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A silicon-based micro pulsating heat pipe with functional channel structure

A pulsating heat pipe and channel structure technology, applied in indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of reducing the volume of liquid phase, reducing the overall size of the pulsating heat pipe, and increasing the overall size, so as to enhance heat transfer. capacity, enhancing the ability to carry heat loads and the effect of cooling and temperature control performance

Active Publication Date: 2016-08-17
JIANGSU UNIV
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among various heat dissipation and cooling technologies for microelectronic devices, pulsating heat pipes are attracting increasing attention because of their simple structure, no need for liquid-absorbing cores, unique heat dissipation performance and good space adaptability, and are considered to be a new type of heat dissipation with great development prospects. cooling technology; but the overall size of ordinary pulsating heat pipes is relatively large, how to effectively match the size of microelectronic chips with limited heat dissipation space has become an important factor restricting its application in this field. Recently, Qu et al. in the International Journal of Heat and Mass "Start-up, heat transfer and flow characteristics of silicon-based micropulsating heat pipes" published on Transfer (International Journal of Heat and Mass Transfer) (Volume 55, Issue 21-22, 2012) , heat transfer and flow characteristics) This paper proposes a micro-pulsating heat pipe technology made of borosilicate glass and silicon wafers etched with micro-channels through MEMS technology, which can greatly reduce the overall size of the pulsating heat pipe , and it can be directly integrated with the chip to truly realize the chip-level cooling function, and at the same time, it can effectively solve the problem of thermal stress concentration caused by incompatibility of materials; , the evaporation section of the micro pulsating heat pipe tends to gradually reduce the volume fraction of the liquid phase, and finally even disappear completely, showing the state of "burning dry", the liquid phase cannot enter it and is confined near the condensation section, the oscillation is suppressed, and the heat transfer temperature control ability At the same time, the paper points out that the above phenomenon is mainly due to the fact that the hydraulic diameter of the micro-pulsation heat pipe channel is small to a certain size, and the working medium is difficult to form an overall circulation movement similar to that of ordinary small-scale pulsation heat pipes, which is very important for improving its heat transfer temperature. Therefore, how to use the unique advantages of MEMS technology in micromachining to properly adjust or improve the channel structure of the micro-pulsation heat pipe and even the overall configuration of the heat pipe to increase its load capacity. The heat load capacity and cooling temperature control performance have also become the key to the development and application of the micro cooler

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  • A silicon-based micro pulsating heat pipe with functional channel structure
  • A silicon-based micro pulsating heat pipe with functional channel structure
  • A silicon-based micro pulsating heat pipe with functional channel structure

Examples

Experimental program
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Effect test

Embodiment 1

[0028] Such as figure 2 and 5 As shown, a silicon-based micro-pulsating heat pipe with a functional channel structure is formed by bonding a pair of semiconductor silicon chips 2 and a heat-resistant borosilicate glass sheet 5; Engraving technology etches a micro-groove 3 with a rectangular cross section; a vacuum / liquid injection hole 4 is processed on the borosilicate glass sheet 5; the vacuum / liquid injection hole 4 is connected with the vacuum / liquid injection microgroove on the semiconductor silicon wafer Corresponding to the top position of channel 1, the vacuum / injection microchannel 1 is connected to the microchannel 3, and 50% volume fraction of FC-72 is filled from the vacuum / injection hole 4.

[0029] figure 2 In this paper, the size of the silicon wafer is 50 mm×35 mm, the longitudinal length of the heat pipe is 40 mm, and the lateral width is 28 mm. The silicon wafer is engraved with 16 micro-grooves whose center line is parallel to the long end boundary of th...

Embodiment 2

[0032] Such as image 3 and 5 Shown, with embodiment 1, the difference is that the micro channel 3 of this functional channel structure silicon-based micro pulsation heat pipe and figure 2 There is a certain difference; the cross-sectional shape and depth of the microchannel are the same as in Example 1, but image 3 Only one of the widths of two adjacent microchannels in the heat pipe shows a continuous linear change along the length of the heat pipe channel. The equivalent diameter of the smaller side is 321.3 μm, and the equivalent diameter of the larger side is 400 μm; while the adjacent The width of the other microchannel remains unchanged at 525 μm, and the equivalent diameter is 365.2 μm.

[0033] Similarly, when the heating power is high, such as image 3 Under the shown channel structure, the vapor and liquid plugs in the channel of the silicon-based micro-pulsation heat pipe can also realize directional movement in the clockwise direction.

Embodiment 3

[0035] Same as Example 1 and Example 2, the cross-sectional shape and depth of the micro channel of the silicon-based micro pulsating heat pipe with functional channel structure are the same as those in Example 1, the longitudinal length of the heat pipe is 40 mm, and the transverse width is 24.5 mm. There are 14 micro-channels, and 7 U-shaped bends are formed on both sides; the cross-sectional shape of the micro-channels is rectangular, and the depth is 280 μm. The difference is that the micro-channels are as follows: Figure 4 As shown in middle 3; at this time, the variation of the width of the micro-channel is that one boundary of the micro-channel changes linearly along the channel length direction, while the other boundary is parallel to the boundary of the silicon wafer, and the width of the smaller side is 280 μm, the larger side is 770 μm, and the corresponding cross-sectional equivalent diameters at both ends of the channel are 280 μm and 410 μm, respectively.

[0036]...

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Abstract

The invention relates to a pulsating heat pipe, in particular to a silicon-based micro pulsating heat pipe with a functional channel structure. The micro pulsating heat pipe is formed by bonding a pair of semiconductor silicon chips and heat-resistant borosilicate glass sheets. A vacuum / liquid injection hole is processed on the acid glass sheet; the vacuum / liquid injection hole is corresponding to the top position of the vacuum / liquid injection micro-channel on the semiconductor silicon wafer, and several holes are etched on the silicon wafer. The micro channel is characterized in that: the width of the micro channel changes linearly along the length direction of the heat pipe. The invention overcomes the disadvantages that the internal working fluid of silicon-based micro-pulsating heat pipes with equal cross-section channels is difficult to form an overall directional circulation movement and the evaporation section is prone to "burning out". Temperature control performance and ability to carry heat load.

Description

technical field [0001] The invention relates to a pulsating heat pipe, in particular to a silicon-based micro pulsating heat pipe with a functional channel structure, which can effectively promote the circulation of working fluid. The thermal effect can be applied to the field of efficient cooling and temperature control of integrated IC electronic components. Background technique [0002] With the rapid development of microelectronics technology and large-scale integrated circuits, the heating intensity of various microelectronic chips is increasing. If the generated heat cannot be removed in time, it will seriously affect the working performance and service life of microelectronic components and even the entire system. Therefore, it is an urgent task for the development of this field to develop efficient and compact microelectronic temperature control technology to solve the problems of narrow chip cooling space and difficult heat dissipation. [0003] Among various heat ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/04
CPCF28D15/0266
Inventor 屈健孙芹王谦韩新月
Owner JIANGSU UNIV