Method for manufacturing hard microneedle array on surface of flexible substrate
A flexible substrate and surface fabrication technology, which is applied to microneedles, processes for producing decorative surface effects, and fabrication of microstructure devices, etc., can solve problems such as limitation, substrate thickness, and overall flexibility of microneedle arrays that are easy to fall off. , to achieve the effect of good biocompatibility and good flexibility
Active Publication Date: 2014-11-12
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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Problems solved by technology
[0004] The existing method for preparing a flexible microneedle array is to embed the root of the microneedle in a flexible substrate. This method has the disadvantages of thick substrate, unstable anchor point between the microneedle and the flexible substrate, easy to fall off, and limited overall flexibility of the microneedle array. insufficient
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[0023] Such as figure 1 as shown, figure 1 The flow chart of the process steps for making the hard microneedle array directly bonded on the flexible substrate provided by the present invention.
[0024] Such as figure 2 as shown, figure 2 A schematic diagram of the process steps for making a hard microneedle array directly bonded on a flexible substrate provided by the present invention, the method includes the following steps:
[0025] Step 1: grow the first Parylene thin film 201 (referring to figure 2 a), to reduce the adhesion between the silicon wafer and the polydimethylsiloxane (PDMS) layer, thereby making the PDMS layer easier to peel off from the silicon wafer surface;
[0026] Step 2: Spin-coat the first PDMS layer 202 on the surface of the first Parylene film 201 (see figure 2 b), heat curing;
[0027] Step 3: the first PDMS layer 202 is peeled off from the surface of the first Parylene film 201 (see figure 2 c);
[0028] Step 4: grow one deck second Pa...
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Abstract
The invention discloses a method for manufacturing a hard microneedle array on the surface of a flexible substrate. The method includes the steps that after a layer of first Parylene film is grown on a silicon wafer, a flexible polymer layer is arranged in a spin coating mode, and heating and solidifying are conducted; the first Parylene film is torn off; after a layer of second Parylene film is grown on the face, in contact with the first Parylene film, of the flexible polymer layer, a polydimethylsiloxane layer is arranged in a spin coating mode, and heating and solidifying are conducted; a layer of silicon dioxide film is grown on the two faces of a metal or semiconductor material; the silicon dioxide film is bonded with a PDMS layer; the silicon dioxide film is torn off; a layer of uniform photoresist is arranged on the silicon dioxide in a spin coating mode, and photoetching is conducted; a hard microcolumn array with a flexible substrate is obtained, and a substrate is formed; after face spin coating of the photoresist is conducted, the substrate is put into corrosive liquid, the hard microcolumn array on the substrate is corroded to form a needle point shape, and preparation is completed. According to the method for manufacturing the hard microneedle array on the surface of the flexible substrate, the comfort in using a microneedle is greatly improved, the risk of breaking the hard microneedle is reduced, and the service life of the microneedle array is prolonged.
Description
technical field [0001] The invention relates to micromachining and manufacturing technology, in particular to a method for fabricating a hard microneedle array on the surface of a flexible substrate, which is used to realize the processing of flexible patch medical devices. Background technique [0002] In recent years, with the development of microelectromechanical (MEMS) technology, microneedle arrays have become more and more widely used in transdermal drug delivery, minimally invasive sampling, electrophysiological signal detection, and biochemical detection. Continuous improvement in application. [0003] For microneedle arrays fabricated directly on silicon wafers, the needle body and substrate are all made of silicon. The silicon substrate is relatively hard and cannot fit the skin surface well, and it is easy to cause pain to the patient during the puncture process. Subsequently, polymer microneedles have been developed, such as PMMA, SU-8 and PET. In 2013, Po-Chu...
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IPC IPC(8): B81C1/00A61M37/00A61B5/04A61B10/02
CPCA61M37/0015A61M2037/0023A61M2037/0046A61M2037/0053
Inventor 裴为华张贺王宇陈远方陈弘达
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI