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Organosilicone composition for electronic device sealing

A technology of electronic devices and compositions, applied in the field of silicone compositions, which can solve problems such as easy yellowing of compositions, weak adhesion to substrates, poor sealing, etc.

Active Publication Date: 2014-11-12
东莞市贝特利新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The sealing organosiloxane composition used for electronic devices can well solve the problem of weather resistance, but due to the inertness of polyorganosiloxane itself, its adhesion to the substrate (such as PPA) is weak, and in the later stage During aging, it is easy to degumming, resulting in poor sealing
In response to this problem, US5744507 pointed out in the report that adding some substances containing epoxy groups and acryloxy groups, and adding some zirconium salts or aluminum salts as accelerators, this method can indeed improve the adhesion to the substrate, but in After adding these substances to the silicone composition, the cured composition is more likely to yellow at high temperature

Method used

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  • Organosilicone composition for electronic device sealing

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0114] The structural formula is (ViSiMe 2 o 0.5 ) 0.3 (PhSiO 1.5 ) 1 (ViSiMe 2 C 2 h 4 SiO 1.5 ) 0.1 The synthesis method of polysiloxane is: weigh 55.8 g of 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 130 g of water, 1.5 g of concentrated sulfuric acid and 300 g of toluene , were added to the four-necked flask, stirred evenly, and slowly added dropwise 396g of phenyltrimethoxysilane and 46.8g of structural formula: Vi (Me) 2 SiC 2 h 4 Si(OCH 3 ) 3 The mixture, the hydrolysis temperature is controlled at 60-70 ° C, after the dropwise addition is completed, continue to reflux for 1 hour. After cooling, the lower layer was separated, and the toluene solution was washed with water 3-4 times. Then 0.20 g of potassium hydroxide was added to the solution, and reflux was carried out, and at the same time, water was removed through the water distribution pipe, and reflux was carried out for 4 hours. After cooling, 0.3 g of acetic acid was added for neutralization, and ...

Synthetic example 2

[0116] The structural formula is (PhMeSiO) 4 (ViSiMe 2 C 2 h 4 Me 2 SiO 0.5 ) 0.2 Synthesis of polysiloxane: Weigh 542g tetramethyltetraphenylcyclotetrasiloxane and 37.4g structural formula: (ViSiMe 2 C 2 h 4 Si Me 2 ) 2 O siloxane in a three-necked flask, heat up and stir, when the temperature rises to 160°C, add 0.1g potassium hydroxide, react for 6 hours, cool, add 0.5g acetic acid to neutralize, wash with water until neutral, remove low boiling, The colorless and transparent structural unit formula obtained is (PhMeSiO) 4 (ViSiMe 2 C 2 h 4 Me 2 SiO 0.5 ) 0.2 of polyphenylsiloxane.

Synthetic example 3

[0118] The structural formula is (HSiMe 2 o 0.5 ) 2 (Ph 2 SiO) 3 (MeViSiO) 0.25 Synthesis of polysiloxane: Weigh 828g of molecular formula as HMe 2 SiO (Ph 2 SiO) 2 SiMe 2 H polysiloxane and 21.5g of tetramethyltetravinylcyclotetrasiloxane were placed in a three-necked flask, and 2.5g of concentrated sulfuric acid was added to control the temperature at 40-50°C. React for 6 hours, cooled, and added to 6g of sodium carbonate And, wash with water, remove low boiler, obtain the colorless and transparent structural formula as (HSiMe 2 o 0.5 ) 2 (Ph 2 SiO) 2 (MeViSiO) 0.25 of polysiloxane.

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Abstract

The invention relates to the technical field of high polymer materials, in particular to an organosilicone composition for electronic device sealing. The organosilicone composition comprises polysiloxane with the structural unit formula being (R1SiMe2O0.5)a(R2SiO1.5)b(ViSiMe2R3SiO1.5)c, polysiloxane with the structure unit formula being (R4SiMe2O0.5)d(R5R6SiO)e(ViSiMe2R7Me2SiO0.5)f, polysiloxane with the structure unit formula being (HSiMe2O0.5)m(R82SiO)n(MeR9SiO)p, and a hydrosilylation catalyst, wherein a+c / b=0.01-1, (d+f) / e=0.01-1, and m / (n+p)=0.1-1. The organosilicone composition has the advantages of being high in tensile strength and adhesive strength and not prone to yellowing.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to an organic silicon composition used for sealing electronic devices. Background technique [0002] The sealing organosiloxane composition used for electronic devices can solve the weather resistance problem very well, but due to the inertness of polyorganosiloxane itself, its adhesion to the substrate (such as PPA) is weak, and in the later stage During aging, it is easy to degumming, resulting in poor sealing. In response to this problem, US5744507 pointed out in the report that adding some substances containing epoxy groups and acryloxy groups, and adding some zirconium salts or aluminum salts as accelerators, this method can indeed improve the adhesion to the substrate, but in After these substances are added to the silicone composition, the cured composition is more likely to yellow at high temperature. [0003] Therefore, there is an urgent need in the industry to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08G77/20C08G77/12
Inventor 汤胜山王全
Owner 东莞市贝特利新材料有限公司