Supercharge Your Innovation With Domain-Expert AI Agents!

Mass positioning structure with curved contact surface

A mass block, curved surface technology, applied in the field of semiconductor devices containing sensors, can solve problems such as acceleration, erroneous measured values ​​of MEMS inertial sensors, inaccurate sensing of acceleration, etc.

Active Publication Date: 2017-07-11
ROBERT BOSCH GMBH +1
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Stiction can cause MEMS inertial sensors to produce erroneous measurements or become inoperable
In particular, some events that cause stiction can cause the mass to stick permanently to the substrate holder, causing the MEMS to stop sensing acceleration
Other events that cause stiction can cause the mass to temporarily stick to the substrate holder, which can cause the MEMS to sense acceleration inaccurately
Therefore, the temporary and permanent adhesion of the proof mass to the substrate holder due to stiction can lead to erroneous measurements by MEMS inertial sensors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mass positioning structure with curved contact surface
  • Mass positioning structure with curved contact surface
  • Mass positioning structure with curved contact surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] For the purpose of promoting an understanding of the principles of the devices and methods described herein, reference will now be made to the embodiments illustrated in the drawings and described in the written description below. It should be understood that no limitation of the scope of the devices and methods is thereby intended. It is further to be understood that the devices and methods include any variations and modifications of the illustrated embodiments, and include further applications of the principles of the devices and methods as would normally occur to one skilled in the art of the devices and methods.

[0031] figure 1 An exemplary embodiment of a microelectromechanical system ("MEMS") 100 is depicted. MEMS 100 is configured to sense acceleration. In particular, when MEMS 100 is accelerated in a direction having a component along the z-axis, MEMS 100 produces an electrical output that is related to the acceleration.

[0032] MEMS 100 includes substrate...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A microelectromechanical system (MEMS) includes a substrate, a first curved surface at a position above a surface of the substrate, and a second curved surface substantially opposite the first curved surface along a first axis parallel to the surface of the substrate, wherein the first curved surface Can move along the first axis in a direction towards the second curved surface.

Description

[0001] This application claims the benefit of US Provisional Application No. 61 / 557,767, filed November 9, 2011, the entire contents of which are hereby incorporated by reference. technical field [0002] The present invention relates to semiconductor devices, and more particularly to semiconductor devices including sensors. Background technique [0003] Microelectromechanical systems, referred to herein as "MEMS" or "MEMS devices," use microfabrication techniques to integrate electrical and mechanical components on the same silicon substrate. Electrical components are assembled using integrated circuit methods, while mechanical parts are assembled using microfabrication methods compatible with integrated circuit methods. This combination makes it possible to assemble entire electromechanical systems on silicon substrates using standard fabrication methods. [0004] A common application of MEMS devices is the design and fabrication of sensors. Due to the sensitivity, spati...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/125
CPCG01P15/125G01P2015/0871G01P2015/0874B81B3/0051B81B2201/0235
Inventor G·奥布赖恩
Owner ROBERT BOSCH GMBH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com