Film imaging method and mask plate

Abstract

The embodiment of the invention discloses a film imaging method and a mask plate, and relates to the technical field of micro-electronics. Films with holes can be deposited on a substrate. The method provided by the invention comprises the following steps: firstly, placing a first mask plate at the upper part of the substrate and conducting primary film deposition under the shielding of the first mask plate, and then, after removing the first mask plate, placing the second mask plate at the upper part of the substrate and conducting secondary film deposition under the shielding of the second mask plate, wherein first shielding parts corresponding to the hole area in the film are arranged on the first mask plate and the second mask plate; the image formed by the complementation of the non-shielding area of the first mask plate and that of the second mask plate corresponds to the film distribution area outside the hole area.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a film patterning method and a mask plate. Background technique [0002] In the manufacturing process of semiconductor devices, it is often necessary to form a thin film with a certain pattern. This process is called patterning of the thin film. [0003] There are many existing thin film patterning methods, among which, the method of depositing a patterned thin film directly on a substrate by using a metal mask has been widely used. This method includes: first, placing a metal with a hollow pattern on the substrate The mask plate, the pattern hollowed out on the metal mask plate corresponds to the pre-deposited pattern, and then the thin film is deposited, so that the pattern hollowed out on the metal mask plate can be transferred to the substrate. [0004] When depositing a thin film on a substrate by the above method, it is not possible to form such figure 1 The figu...

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Problems solved by technology

[0004] When depositing a thin film on a substrate by the above method, it is not possible to form such figure 1 The figure with the hole 1 shown, because the hole 1 on the film should correspond to the shielding area other than the hollow pattern on the metal mask, if the hole 1 is to be formed on the film, then the metal mask must have There are multiple independent occlusion areas corresponding to hole 1, and these independent occlusion areas cannot be connected

That is to say, the metal mask board is not a complete board that can be used alone, but contains multiple independent parts. However, using such a metal mask board, it is impossible to achieve precise alignment between the independent parts. This defeats the purpose of using a metal mask, so the metal mask does not exist

Therefore, the film with the hole 1 cannot be directly deposited and formed on the substrate by using the existing metal mask.

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