LED module and production method therefor, lighting device

A technology of LED modules and LED chips, which is applied to lighting devices, lighting and heating equipment, semiconductor devices of light-emitting elements, etc., can solve the problems of reducing light extraction efficiency, etc., and achieve the effect of improving light extraction efficiency and improving light extraction efficiency.

Inactive Publication Date: 2014-12-10
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is speculated that the light extraction efficiency will decrease due to the a

Method used

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  • LED module and production method therefor, lighting device
  • LED module and production method therefor, lighting device
  • LED module and production method therefor, lighting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] In the following, reference will be made to Figures 1 to 8 The LED module 1 of this embodiment is described.

[0081] The LED module 1 includes: a base 4 having a face 4sa in the thickness direction of the base 4; an LED chip 6 bonded to the face 4sa of the base 4 with the first bonding portion 5; Wiring circuit (patterned conductor) 8 .

[0082] In the LED module 1 , the first bonding portion 5 allows the light emitted from the LED chip 6 to pass therethrough, and the base 4 is a light-transmitting member having light-diffusing properties. The translucent member propagates incident light to the outside by refraction or internal diffusion (scattering).

[0083] The plane size of the base 4 is larger than the plane size of the LED chip 6 . A patterned wiring circuit 8 is provided on the face 4 sa of the submount 4 to avoid overlapping with the LED chip 6 . The base 4 is composed of at least two transparent layers stacked in the thickness direction of the base 4 . T...

Embodiment 2

[0237] The LED module 1 of this embodiment differs from the LED module 1 of Embodiment 1 in that, as Figure 32As shown in A, 32B and 32C, the base 4 has an elongated shape and includes a plurality of LED chips 6 . Note that constituent elements similar to those in Embodiment 1 have the same reference numerals, and repeated description thereof will be omitted.

[0238] In the LED module 1, along a predetermined direction on the surface 4sa of the base 4 ( Figure 32 The horizontal direction in B) aligns a plurality of LED chips 6 . In the LED module 1 , the LED chips 6 aligned in a prescribed direction and the wires 7 connected to the corresponding LED chips 6 are covered with a strip-shaped color conversion portion 10 . The color conversion portion 10 has a concave portion 10b to suppress total reflection of light emitted from each LED chip 6 between LED chips 6 adjacent to each other in a prescribed direction.

[0239] The patterned wiring circuit 8 serving as a circuit i...

Embodiment 3

[0304] In the following, reference will be made to Figures 37 to 39 The LED module 1 of this embodiment is described.

[0305] The LED module 1 of this embodiment is different from the LED module 1 of Embodiment 2 in that the base 4 has a square shape, and a plurality of (36 in the example in the figure) LED chips 6 are arranged in a two-dimensional array. Note that constituent elements similar to those in Embodiment 2 have the same reference numerals, and repeated description thereof will be omitted.

[0306] The LED module 1 comprises a plurality of LED chips 6 on the face 4 sa of the submount 4 . The patterned wiring circuit 8 includes a first conductor 8 a and a second conductor 8 b arranged independently from each other on the surface 4 sa of the base 4 . In the LED module 1, the plurality of LED chips 6 includes a group of LED chips 6 connected in series and arranged on an imaginary line M1 connecting the first conductor 8a and the second conductor 8b to each other. ...

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Abstract

An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond allows light emitted from the LED chip to pass therethrough. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip. A lighting device includes a light source that is the LED module.

Description

technical field [0001] The invention relates to an LED module, a method for manufacturing the LED module and a lighting device. Background technique [0002] Previously, it has been proposed to have Figure 45 A light emitting device 100 of the configuration shown (JP2008-91831A: Patent Document 1). The light emitting device 100 includes: a base substrate 120 having a nitride-based ceramics substrate 121, an Au layer 124 provided on the surface of the nitride-based ceramics substrate 121, an Au layer interposed between the nitride-based ceramics substrate 121 and the Au layer 124. an oxide layer 123 ; and an LED light emitting element 126 mounted on the base substrate 120 via the solder layer 125 . The oxide layer 123 includes metal oxide as a main component. The base substrate 120 has a reflective layer 122 made of at least one of Ag and Al, which is formed on the surface of the nitride-based ceramic substrate 121 without overlapping the Au layer 124 . [0003] Patent Do...

Claims

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Application Information

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IPC IPC(8): H01L33/48
CPCH01L33/58H01L33/486H01L2224/48091H01L2224/73265H01L25/0753H01L33/60H01L33/48H01L33/502H01L33/56H01L33/507H01L33/504H01L2224/45144F21K9/27H01L2924/181H01L2224/48137H01L2224/48227H01L2224/8592H01L33/62H01L2924/00014H01L2924/00H01L2924/00012H01L33/642H01L33/50H01L2933/0058
Inventor 浦野洋二田中健一郎中村晓史平野彻日向秀明铃木雅教横田照久
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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