Copper paste composition for printing, and method of forming metal pattern using same
A metal pattern and composition technology, which is applied to the formation of electrical connection of printed elements, printed circuits, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the need for additional processes, expensive silver compositions or copper compositions, etc problem, to achieve the effect of excellent adhesion
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Synthetic example 1
[0062] Synthesis example 1: Synthesis of copper powder
[0063] In the 30g copper precursor CuCl 2 27.5g of 1,8-bis(dimethylamino)naphthalene was added to an aqueous solution prepared by dissolving a metal precursor in 450ml of water until the green mixed solution became a gel-like light green Forced stirring was performed until the material was removed. Thereafter, 27.5 g of hydrazine was added slowly, and forced stirring was performed until the solution turned dark red. At this time, the reaction temperature was maintained at 40°C.
[0064] The dark red powder was recovered by centrifugation, washed and recovered with methanol repeatedly, and then stored in an atmospheric pressure atmosphere.
Synthetic example 2
[0065] Synthesis Example 2: Synthesis of Copper Powder
[0066] Except having used 25.4 g of tetramethylguanidines instead of 1,8- bis-dimethylaminonaphthalene, it synthesize|combined by the method similar to the said synthesis example 1, and stored the dark red copper powder.
Embodiment 1 to 10
[0067] Examples 1 to 10, and comparative examples
[0068] The copper powder prepared in said synthesis example 1 was mixed with the composition shown in following Table 1, respectively, and the copper paste composition for printing of Examples 1-10 and a comparative example was prepared. (EC: ethyl cellulose, AB: acrylic resin, BC: butyl carbitol (diethylene glycol butyl ether), BCA: diethylene glycol monobutyl ether acetate, TPN: terpineol, GBL: γ -Butyrolactone, MS: Mercaptopropylmethyldimethoxysilane, MAS: Methacryloxypropyltrimethoxysilane, EMS: Epoxycyclohexylethyltrimethoxysilane, DMOA: Dimethyl Caprylic Acid, OA: Oleic Acid, MMB: Mercaptomethylbenzimidazole, BDG: Diethylene Glycol Butyl Ether, MMI: Mercaptomethylimidazole)
[0069] Table 1
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[0071]
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