Heat pipe and manufacturing method thereof

Abstract

The invention provides a manufacturing method of a heat pipe. The manufacturing method of the heat pipe comprises the following steps that a pipe body and a vascular net are provided, wherein the pipe body is provided with an open end; the vascular net is coated with solder paste; the vascular net is rolled into a vascular pipe, and the vascular pipe is arranged in the pipe body with the side, coated with the solder paste, facing outwards; the pipe body is roasted, so that the pipe body and the vascular pipe are combined more completely and more tightly, heat transmission resistance is reduced, and the heat dissipation efficiency of the heat pipe is improved on the premise that the heat pipe is thin enough. In addition, the invention provides the heat pipe.

Description

technical field [0001] The invention relates to a heat pipe and a manufacturing method thereof. Background technique [0002] At present, heat pipes have been widely used in the heat dissipation of electronic components with large heat generation. When the heat pipe is working, the low-boiling-point working fluid filled in the pipe body absorbs the heat generated by the heating electronic components in the evaporation section, then evaporates and vaporizes, moves to the condensation section with heat, and liquefies and condenses in the condensation section to release the heat. The final working fluid flows back to the evaporation section under the action of the capillary structure of the heat pipe wall. Through the circulating movement of the working fluid, the heat generated by the electronic components is quickly transferred to the radiator in contact with the condensation section of the heat pipe and dissipated. Due to the requirement of thinner and thinner electronic de...

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Problems solved by technology

[0003] However, in the prior art, after the vessel is placed in the tube body, high-temperature baking is usually used to bond the vessel and the tube body at high temperature so as to bond the vessel to the inner wall of the tube. The high-temperature bonding method is that the vessel and the tube The atoms of the two materials of the body are combined by forming covalent bonds or ionic bonds. However, this high-temperature bonding method usually has higher requirements on external conditions, such as pressure, temperature, and the distance between the two materials. The flatness of the indirect contact surface, etc., and the yield rate of the high-temperature bonding method is not high, which often makes the contact between the vessel and the inner wall of the tube body poor, which in turn produces a certain degree of heat transfer resistance, thereby affecting the heat dissipation of the heat pipe efficiency

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