Copper alloy plate with excellent electrical conductivity and deflection coefficient
A copper alloy plate and electrical conductivity technology, applied in the field of electronic parts, can solve the problems of stress, that is, contact force reduction, contact resistance increase, etc., and achieve the effects of high conductivity, high strength, and high deflection coefficient
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[0072] Examples of the present invention are shown together with comparative examples below, but these examples are provided for better understanding of the present invention and its advantages, and are not intended to limit the invention.
[0073] After adding alloying elements to molten copper, it is cast into an ingot with a thickness of 200 mm. The ingot was heated at 950° C. for 3 hours, and hot-rolled to form a plate with a thickness of 15 mm. After grinding and descaling the surface of the hot-rolled sheet, annealing and cold-rolling are repeated, and the final cold-rolling is finished to a predetermined product thickness. Finally, stress relief annealing is performed.
[0074]In hot rolling, the maximum value (Rmax) and the average value (Rave) of the working degree per pass are varied in various ways.
[0075] The annealing (final recrystallization annealing) before final cold rolling used a batch furnace, and the heating time was set to 5 hours, and the temperature...
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