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Silicon-free water-based cutting fluid for electronic aluminum processing

A technology of aluminum processing and cutting fluid, applied in the petroleum industry, lubricating compositions, etc., can solve the problems of poor anti-corruption performance, affecting the production and working environment of enterprises, and short cycle life, achieving excellent corrosion resistance and improving anti-corruption Effects of performance and cycle life extension

Active Publication Date: 2016-08-24
SHANGHAI YUSHIRO CHEM IND +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First, the anti-corruption performance is poor, and the cycle life is short (although the working fluid is also added with a fungicide, it generally starts to grow bacteria, smell, rot and deteriorate after less than 10 months of use, and the fluid needs to be changed in time
This will not only seriously affect the production and working environment of the enterprise, but also increase the cost of liquid replacement and waste liquid treatment); second, the formula contains toxic and harmful substances such as sodium nitrite, which affects environmental safety and endangers human health

Method used

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  • Silicon-free water-based cutting fluid for electronic aluminum processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A special silicon-free water-based cutting fluid for electronic aluminum processing, which is a product obtained by mixing and stirring the following weight components:

[0022] Naphthenic mineral oil 52%

[0023] 2-Aminoethoxyethanol 8%

[0024] Boric acid 2%

[0025] Polyetherester 11%

[0026] Diethylamine block polyether 5%

[0027] Polyethylene Glycol Oleate 7%

[0028] Sorbitan Oleate 3%

[0029] Oleic Acid 4%

[0030] Water 8%.

Embodiment 2

[0032] A special silicone-free water-based cutting fluid for electronic aluminum processing, consisting of the following components in weight percentage:

[0033] Base oil 50-70% (eg 50%, 60%, 70%)

[0034] Rust inhibitor 10-20% (eg 10%, 15%, 20%)

[0035] Synthetic lubricant 10-15% (eg 10%, 12%, 15%)

[0036] Surfactant 5-10% (eg 5%, 8%, 10%)

[0037] water balance.

[0038] The base oil is naphthenic mineral oil or paraffinic mineral oil.

[0039] The antirust agent is one or a mixture of two or more of fatty acids, alkyl sulfonates, amines, monoethanolamine amide boric acid, ammonium sulfonate, boric acid, boric acid ester, and oleic acid.

[0040] Synthetic lubricants refer to one or more of synthetic esters such as polyesters, dibasic acid diesters or polyol esters.

[0041] The surfactant is one of diethylamine block polyether, Geert eicosanol polyethylene glycol-1000 succinate diester, Geert eicosanol polyethylene glycol-1500 succinate diester species or several.

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Abstract

The invention discloses a special water-based silicon-free cutting fluid for electronic aluminum machining. The cutting fluid is composed of base oil, an anti-rusting agent, a synthetic lubricant, a surfactant and water. The cutting fluid does not contain silicon and is excellent in defoaming performance, aluminum corrosion inhibition and rusting resistance.

Description

technical field [0001] The invention relates to a special silicon-free water-based cutting fluid for electronic aluminum processing. Background technique [0002] At present, the cutting fluids for electronic aluminum processing on the domestic market generally use silicon-containing aluminum corrosion inhibitors and defoamers in their formulations. Although silicon-containing cutting fluids for electronic aluminum processing have excellent aluminum corrosion inhibition and defoaming properties, there is also a prominent disadvantage: it is difficult to meet the subsequent performance and quality requirements of electronic products during processing (electronic products containing silicon are easy to cause short circuits 1. Poor reading and writing of the hard disk; silicon volatilized at high temperature is adsorbed on the surface of electronic components, resulting in resistance value change or resistance breakdown; the existence of silicon-containing substances will also ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C10M169/04C10M173/00C10N40/22C10N30/12C10N30/18
Inventor 林丽静常建忠阿部聪俞威吴志桥
Owner SHANGHAI YUSHIRO CHEM IND