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System for treating substrate, laminating apparatus contained in the system, and method for treating substrate

A technology of substrate processing system and lamination device, which is applied in the direction of lamination device, lamination, lamination system, etc., and can solve problems such as bending and cracks in thin plate glass

Active Publication Date: 2015-02-11
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Also, when thin sheet glass is laminated on carrier glass, warping may occur due to the difference in coefficient of thermal expansion between the two glasses and the pressure during lamination
Cracks may develop in thin sheet glass if bending is not adequately controlled

Method used

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  • System for treating substrate, laminating apparatus contained in the system, and method for treating substrate
  • System for treating substrate, laminating apparatus contained in the system, and method for treating substrate
  • System for treating substrate, laminating apparatus contained in the system, and method for treating substrate

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Embodiment Construction

[0041] Since the present invention can have various modified embodiments, exemplary embodiments are illustrated in the drawings. However, this does not limit the present invention to specific embodiments, and it should be understood that the present invention covers all modifications, equivalents, and replacements within the idea and technical scope of the present invention. In describing the present invention, detailed descriptions related to well-known functions or configurations will be excluded to prevent unnecessarily obscuring the main subject of the present invention.

[0042]It will be understood that although the terms "first" and "second" are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one component from other components.

[0043] The terms of singular form may include plural forms unless otherwise specified. As used herein, the terms "comprising", "comprising" and "comprisi...

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PUM

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Abstract

A system for treating substrates is provided. The system for treating the substrates comprises a first cavity and a second cavity. The first cavity comprises a first laminating part, in the first laminating part, a first substrate corresponds to a second substrate, and the first substrate and the second substrate are contacted with each other, and therefore the first substrate and the second substrate are initially laminated. The second cavity comprises a second laminating part, in the second laminating part, the first substrate and the second substrate which are initially laminated are pressed and laminated onto each other.

Description

[0001] related application [0002] This application claims the benefit of Korean Patent Application No. 10-2013-0089824 filed with the Korean Intellectual Property Office on Jul. 29, 2013, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] One or more embodiments of the present invention relate to a substrate processing system for laminating thin plate glass on carrier glass, a lamination apparatus included in the system, and a substrate processing method using the substrate processing system. Background technique [0004] Display devices are changing towards being lightweight, portable and foldable. Therefore, thinner display devices are required. [0005] In order to manufacture a flat panel display device, the substrate and the encapsulation substrate may be etched to reduce the overall thickness of the display device after manufacturing the display device. However, the display device manufactured by the above method m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCB32B37/10H01L21/67011B32B38/162B32B38/1808B32B39/00B32B2038/1891B32B2041/04
Inventor 李洪鲁高要燮洪圣勋明承镐郑炳和
Owner SAMSUNG DISPLAY CO LTD