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Polyamide composite material with high thermal conductivity and high heat resistance and preparation method thereof

A composite material and polyamide technology, which is applied in the field of high thermal conductivity and high heat resistance polyamide composite materials and their preparation, can solve the problems of low thermal conductivity of thermally conductive PA and insufficient heat resistance, and achieve good thermal conductivity and improved thermal conductivity. The effect of low thermal conductivity and filler cost

Inactive Publication Date: 2015-02-25
SHANGHAI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Patent application number 200780011249.0 discloses the preparation of thermally conductive PA using PA66 as the resin matrix and alumina as the filler. Since the thermal conductivity of the single filling of alumina is not high, the thermal conductivity of the thermally conductive PA disclosed by this method is not high, and Heat resistance is not outstanding enough

Method used

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  • Polyamide composite material with high thermal conductivity and high heat resistance and preparation method thereof
  • Polyamide composite material with high thermal conductivity and high heat resistance and preparation method thereof
  • Polyamide composite material with high thermal conductivity and high heat resistance and preparation method thereof

Examples

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Effect test

Embodiment 1-6

[0034] A polyamide composite material formula with high thermal conductivity and high heat resistance and a preparation method thereof, comprising the following steps:

[0035] (1) Prepare materials according to the components and contents in Table 1. The halogen-free flame retardants are red phosphorus and phosphorus-based composite flame retardants; boron nitride is hexagonal boron nitride with a size of 5 microns; alumina It is thermally conductive spherical alumina with a size of 50 microns; the graphite is flake graphite with a size of 104 microns; the coupling agent is a silane coupling agent; the antioxidant is a composite system of hindered phenolic antioxidant and phosphite antioxidant ; The lubricating dispersant is a BAB type copolymer containing polar groups prepared from ethylene bis fatty acid amide (EBS) as the base material.

[0036] (2) Put the above raw materials into the high-mixer and mix them for 3-5 minutes, then discharge to obtain the mixture, then cont...

Embodiment 1

[0042] Example 1 is to add more polymer matrix and less flake graphite. According to the test results, we can see that the thermal conductivity of the material is low, but the surface resistance is high and the insulation is good. Embodiment 4 adds more flake graphite, and there is a suitable ratio between hexagonal boron nitride, spherical alumina and flake graphite flakes, the addition amount is suitable, can be processed easily, has very high thermal conductivity, and surface resistance It meets the insulation requirements, and the flame retardant performance reaches V0, and the high temperature resistance performance is good.

[0043] At the same time, we used no flame retardant system, a system filled with PA46 with boron nitride single thermal conductive filler and boron nitride and alumina binary composite thermal conductive filler, and a system with PA66 instead of PA46 polyamide as the matrix resin for comparison. , which shows the comprehensive advantages of the pres...

Embodiment 7

[0051] No flame retardant is added in Example 7, so the flame retardant performance of the composite material is greatly reduced and only reaches the V2 level; Example 8 adds less polymer matrix and single thermally conductive filler boron nitride, although there are many fillers added , but according to the test results, we can see that the thermal conductivity of the material is low; Example 9 uses binary composite thermal conductive fillers boron nitride and aluminum oxide to fill less PA46 matrix resin, and its thermal conductivity is also relatively low. Low. Compared with Example 4 with the same formulation, Example 10, which uses PA66 instead of PA46, has lower thermal conductivity and a greater drop in heat resistance.

[0052] It can be drawn from the above examples that the performance of the flame-retardant insulating heat-conducting plastic of the present invention is excellent, the flame-retardant performance can reach V0, and the surface resistance is between 10 ...

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Abstract

The invention relates to a polyamide composite material with high thermal conductivity and high heat resistance and a preparation method thereof. The composite material comprises the following components in percentage by mass: 20%-50% of matrix resin, 40%-65% of composite heat-conducting fillers, 4%-12% of a halogen-free flame retardant, 0.5%-2% of a coupling agent, 0.2-1% of an antioxidant and 0.2%-1% of a lubricating dispersant. PA46 resin with a symmetrical molecular chain structure and high crystallinity is taken as the matrix resin; different heat-conducting fillers with different shapes and particle sizes are added to be overlapped between the heat-conducting fillers; and meanwhile, a small amount of flame retardant is added, so that the polyamide composite material disclosed by the invention has excellent heat-conducting property, flame retardant property and insulating property, and meets the operating requirements of electronic and electrical appliances, is high in design freedom, and can be widely applied to the fields such as LED lampshades, printed circuit boards and electrical devices.

Description

technical field [0001] The invention relates to a polyamide composite material and a preparation method thereof, in particular to a polyamide composite material with high thermal conductivity and high heat resistance and a preparation method thereof. Background technique [0002] Plastics have the advantages of light weight, high strength, insulation, good formability and designability, but when plastics are used in electronic and electrical components, display frames, computer cooling parts and LED lights, etc., due to the thermal conductivity of plastics Relatively low, it is difficult to dissipate the heat in time, resulting in the accumulation of heat and reducing the service life and stability of the material. Based on this, the development and research of thermally conductive plastics has entered people's field of vision. Thermally conductive plastics are divided into intrinsic type and filled type. The intrinsic type is difficult to operate and high in cost, so we ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08K13/04C08K3/38C08K7/18C08K3/22C08K3/04C08K3/02C08K5/523C08K5/521C08K5/3492B29C47/92B29C48/92
CPCC08L77/02B29C48/92B29C2948/9258B29C2948/92704C08K2201/003C08L77/06C08L2201/02C08L2201/08C08L2201/22C08L101/00C08K13/04C08K7/18C08K2003/2227C08K2003/026C08K2003/385C08K3/04
Inventor 刘引烽徐华根张阳周海堤王宇翔朱逸莉
Owner SHANGHAI UNIV