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Mounting technology of chip type sensor

An installation process and sensor technology, applied in the direction of material gluing, connecting components, mechanical equipment, etc., to ensure durability and weather resistance, and facilitate batch loading.

Inactive Publication Date: 2015-03-11
深圳市伊爱高新技术开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the object of the present invention is to provide a kind of chip sensor installation process that is easy to control in batch loading, has good bonding durability and weather resistance, so as to solve the problem of batch loading of strain gauge sensors

Method used

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  • Mounting technology of chip type sensor
  • Mounting technology of chip type sensor

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] combine figure 1 and figure 2 As shown, the chip sensor installation process described in this embodiment specifically includes:

[0027] First process the substrate 1, wherein the substrate 1 is a stainless steel plate or stainless steel sheet (SUS304), the size is 40*30mm, the thickness is 0.2~0.3mm, and the front of the stainless steel plate needs to be finely drawn, and then the distribution of solder joints is printed And the sensor bonding area 11, the back side is not processed.

[0028] Secondly, after detecting the chip sensor 2 to determine that it has no quality problems, appl...

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Abstract

The invention provides a mounting technology of a chip type sensor. The technology comprises the step of fixing a substrate bonded with the chip type sensor on a vehicle in a glue seal manner completely. The substrate is an added one on the basis of a prior art. The chip type sensor is bonded to the front face of the substrate correspondingly and then the substrate is fixed to the vehicle correspondingly in a welding manner. And the substrate bonded with the chip type sensor is fixed on the vehicle in a glue seal manner completely. At the same time, the chip type sensor is connected to the vehicle after being connected with a lead in a welding manner, so that real time monitoring of a load carrying condition of the vehicle is realized. According to the invention, the chip type sensor and the substrate are combined integrally, so that loading in mass is facilitated greatly and thus becomes easy in control. Moreover, bonding durability and weather fastness are guaranteed by adopting the above technology.

Description

technical field [0001] The invention relates to vehicle overload electronic weighing technology, in particular to a chip sensor installed on a vehicle for detecting vehicle overload, and more specifically, an installation process of the chip sensor on a vehicle. Background technique [0002] Vehicle overloading refers to the situation that the quality of the goods carried by the transport vehicle exceeds the rated loading quality. The main hazards of vehicle overloading are as follows: 1. Vehicle overloading will increase the damage to the road surface of the vehicle. The damage relationship to the road surface obeys the "sixteenth law", that is, every time the axle load of the car doubles, the road damage will increase by 16 times; 2. It is easy to cause road traffic accidents. After the car is overloaded, the vehicle is in an overloaded state Driving will lead to a rapid decline in safety performance such as braking and operability of the vehicle, manifested as tire deform...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16B11/00
CPCF16B11/006
Inventor 康聪伟周伍阳梁毛鹞苏孟良
Owner 深圳市伊爱高新技术开发有限公司