Interposer, manufacturing method, packaging structure and bonding method for interposer

Abstract

The invention discloses an interposer, a manufacturing method, a packaging structure and a bonding method for an interposer. The interposer comprises a plate body, conical electric conductors and a wiring structure, wherein the plate body is provided with a first surface and a second surface which are opposite, and frustum-shaped through holes penetrating the plate body are formed between the first surface and the second surface; the conical electric conductors are filled inside the frustum-shaped through holes, the conical electric conductors are provided with a flat end and a tip, the flat end is level with the first surface, and the tip protrudes out of the second surface; the wiring structure is arranged on the first surface of the plate body and is electrically connected with the flat ends of the conical electric conductors. By directly inserting the tips protruding on the interposer into a solder ball, the interposer can conveniently achieve bonding with a dielectric slab. Therefore, a UBM (Under Bump Metal) manufacturing process on the interposer can be avoided, time and costs can be effectively saved, besides, contact surface of the conductors and a solder ball can be increased, and further the bonding strength is larger and the bonding reliability is higher.

Description

technical field [0001] The present invention relates to the field of packaging, in particular to an adapter plate, a manufacturing method thereof, an encapsulation structure and a bonding method for the adapter plate. Background technique [0002] Three-dimensional system-level integration technology is to stack different chips or subsystems on a three-dimensional scale and form a vertical interconnection structure. Therefore, compared with the traditional packaging technology, the packaged device made by the 3D system integration technology has smaller external dimensions and higher integration density. [0003] In the three-dimensional system integration technology, the interposer between the chipset and the substrate plays a linking role. Specifically, the chipset and the substrate are interconnected through conductors filled in the conductive vias of the interposer. The adapter board has the advantages of signal redistribution, heat conduction, and passive device integ...

AI Technical Summary

Problems solved by technology

Among them, the process of arranging UBM 106 is a relatively complicated process, which requires more time and cost

Moreover, in this bonding method, the contact area between the conductor 210 in the adapter plate 101 and the solder ball 105 is small, resulting in low bonding strength and low bonding reliability.

Images