A horizontal diffusion furnace with an inlet quartz gun

Abstract

The invention discloses an air intake silica gun for a horizontal diffusion furnace used for injecting process gas. The silica gun is a hollow silica gun tube, the opening end of the silica gun is mechanically and hermetically connected with an air inlet pipe of the diffusion furnace used for injecting the process gas through a cooperation way of a ball head and a ball bowl with mirror polishing cooperation surfaces, and a plurality of air outlet nozzles are formed in the side wall of the silica gun nearby a closing end; each group of air outlet nozzles comprises a plurality of nozzles, the process gas can be injected uniformly and radially in all nozzles after entering the silica gun through the air inlet pipe, and cover the surfaces of all silicon pieces obliquely below an exhaust port under the suction and guiding effects of the exhaust port, therefore, the leakage of the process gas can be effectively prevented, the uniformity of a diffusion technology can be improved, the influence of fluctuation on the process temperature can be reduced, and the rate of equipment utilization can be improved.

Description

technical field [0001] The present invention relates to the field of semiconductor equipment, and more particularly, to a horizontal diffusion furnace containing an air-intake quartz gun. Background technique [0002] With the development of the semiconductor integrated circuit manufacturing process, the feature size is continuously reduced, which makes the integration of the chip higher and higher, which puts forward higher requirements for the integrated circuit manufacturing and process equipment. The latest process development is more and more affected by the process equipment. Constraints. [0003] Semiconductor diffusion equipment is an important process equipment for integrated circuit manufacturing. As an automatic control equipment that requires continuous work for a long time, and has excellent temperature control accuracy, good reliability and stability, it is used in the integrated circuit manufacturing process. Various oxidation, annealing and thin film growth ...

AI Technical Summary

Problems solved by technology

[0006] There are obvious defects in the air intake structure and the method adopted by the gas transmission system of the above-mentioned existing semiconductor horizontal diffusion furnace: since the nozzle for injecting the process gas is located at the end face of the quartz gun 3, and there is only one nozzle, therefore, from the nozzle The flow rate and velocity of the injected process gas are relatively large, and the gas column formed by the gas flow is also narrow (please refer to the effect of the range of the gas column formed by the curved arrow at the nozzle in the figure)

This will have a certain impact on production efficiency, and the quartz gun is very brittle, and it is easy to cause damage to the matching part of the ball bowl and the ball head during disassembly. The residue of the sealing gasket at the place needs to be cleaned time-consumingly, which will further affect the production efficiency

[0008] The above problems will directly affect the uniformity of the diffusion process, the effect of the process, and bring adverse consequences to production efficiency and maintenance costs

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