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Server

A server and heat exchanger technology, applied in the server field, can solve the problems of high volume and power, occupying space for electronic components, and achieve the effect of improving heat dissipation efficiency

Inactive Publication Date: 2015-03-18
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
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  • Description
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AI Technical Summary

Problems solved by technology

However, when the number of fans increases or the volume is larger and the power is higher, it will take up the installation space of electronic components and even generate more noise
In addition, when each electronic component (such as two central processing units) is arranged at intervals, the heat dissipation module in the prior art cannot effectively perform better heat exchange on multiple electronic components at the same time.

Method used

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Embodiment Construction

[0054] Please refer to figure 1 , which is a schematic top view of a server 10 according to an embodiment of the present invention. A server 10 includes a casing 100 , a motherboard 200 , a cooling module 300 and a power supply 400 .

[0055] In this embodiment, the motherboard 200 is disposed in the casing 100 . The motherboard 200 includes two heat sources 210 , 220 , multiple slots 230 , and multiple adapter cards 231 . The heat sources 210, 220 are arranged at intervals, that is, at a distance from each other. In this embodiment, the heat sources 210 and 220 are respectively a central processing unit (CPU), but this is not intended to limit the present invention. In other embodiments, the heat source is a chipset, a storage device or a power supply, and the number of heat sources can be a positive integer greater than two. When the server 10 is running, the heat sources 210 and 220 are energized to generate heat energy. In this embodiment, the slots 230 are respective...

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Abstract

A server includes a housing, a motherboard and a heat dissipating module. The motherboard is disposed inside the housing and includes multiple heat sources. The heat dissipating module includes a cooling plate disposed inside the housing and in thermal contact with multiple heat sources. The cooling plate includes a substrate, a casing and multiple fins. The substrate is in thermal contact with multiple heat sources. The casing is disposed on the substrate, while the casing and the substrate form a chamber. Multiple fins are disposed on the substrate and are inside the chamber.

Description

technical field [0001] The invention relates to a server; in particular, it relates to a server with a cooling module. Background technique [0002] With the development of information technology, the use of electronic devices is becoming more and more popular. At the same time, in order to meet various needs of people, the calculation speed of electronic devices is also getting faster and faster, and the functions are getting more and more powerful. Taking a server as an example, it may include multiple electronic components, such as multiple central processing units, multiple storage devices, and multiple adapter cards. In this way, the server can use the above-mentioned modules to increase computing speed, expand storage capacity, and expand functions. [0003] However, when the computing speed of the electronic components increases or the number of the electronic components increases, the heat generated by the electronic components also increases, and the temperature of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCH05K7/20136H05K7/20772G06F1/20G06F2200/203
Inventor 林茂青黄国经
Owner INVENTEC PUDONG TECH CORPOARTION
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