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Semiconductor packaging piece and manufacturing method thereof, and cutting jig used for manufacturing method

A manufacturing method and semiconductor technology, which are applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve problems such as the reduction of the bonding between the heat sink and the sealant.

Active Publication Date: 2015-03-18
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the singulation step, since the heat sink is torn by the cutting force of the cutter, the bonding between the heat sink and the sealant is likely to be reduced

Method used

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  • Semiconductor packaging piece and manufacturing method thereof, and cutting jig used for manufacturing method
  • Semiconductor packaging piece and manufacturing method thereof, and cutting jig used for manufacturing method
  • Semiconductor packaging piece and manufacturing method thereof, and cutting jig used for manufacturing method

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Embodiment Construction

[0050] Please refer to figure 1 , which shows a cross-sectional view of a semiconductor package according to an embodiment of the present invention. The semiconductor package 100 includes a substrate 110 , a semiconductor chip 120 , a plurality of electrical contacts 130 , a package body 140 and a heat dissipation plate 150 .

[0051] The substrate 110 is, for example, a single-layer or multi-layer substrate, which can carry a semiconductor chip 120 . The substrate 110 has an upper surface 110u and a lower surface 110b. In this example, the semiconductor chip 120 is disposed on the upper surface 110 u of the substrate 110 with the active surface 120 a facing upwards, and is electrically connected to the substrate 110 through at least one bonding wire 121 . In another example, the semiconductor chip 120 is disposed on the upper surface 110u of the substrate 110 in a flip chip mode with the active face facing downward, and is electrically connected to the substrate 110 through...

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PUM

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Abstract

The invention discloses a semiconductor packaging piece. The semiconductor packaging piece comprises a substrate, a semiconductor chip, a packaging body, a plurality of electric contacts and a heat sink. The substrate is provided with an upper surface and a lower surface; the semiconductor chip is arranged on the upper surface of the substrate; the packaging body is formed on the upper surface of the substrate and wraps the semiconductor chip; the electric contacts are formed on the lower surface of the substrate; the heat sink is arranged on the packaging body and is provided with an upper surface, an outer side face and a burr; the burr is formed between the upper surface and the outer side face of the heat sink; the protrusion of the burr is less than 3 milli-inches.

Description

technical field [0001] The present invention relates to a semiconductor package, its manufacturing method and cutting jig used therefor, and in particular to a semiconductor package formed by cutting from a cooling plate to a substrate, its manufacturing method and its cutting tool. update. Background technique [0002] For heat dissipation, a conventional semiconductor package includes a heat sink to quickly dissipate the heat of the semiconductor package. Most heat sinks are made additionally and then pasted on the sealant. However, in the singulation step, since the heat dissipation plate is torn by the cutting force of the cutter, the bonding between the heat dissipation plate and the sealant is easily reduced. Contents of the invention [0003] The present invention relates to a semiconductor package, its manufacturing method and cutting jig used therefor. In one embodiment, the bonding between the cooling plate and the package will not be excessively reduced due to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/34H01L21/78
CPCH01L24/97H01L2224/48091H01L2924/15311H01L2924/181H01L2924/00012H01L2924/00014
Inventor 张嘉铭李金松黄柏庭孙铭伟刘承政
Owner ADVANCED SEMICON ENG INC