A kind of ptmg modified moisture curing polyurethane hot melt adhesive and preparation method thereof
A polyurethane hot-melt adhesive and moisture-curing technology, which is applied in the direction of polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of poor hydrolysis resistance, poor flexibility, and low peel strength, and achieve hydrolysis resistance Good performance, low cost, overcome the effect of low peel strength
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Embodiment 1
[0043] A PTMG modified moisture-curing polyurethane hot-melt adhesive, the following components are taken in parts by mass: 35 parts of polypropylene glycol, 15 parts of polytetrahydrofuran diol, 8 parts of poly-1,6-hexanediol adipate, 0.5 parts of antioxidant, 15.99 parts of tackifying resin, 25 parts of 4,4'-diphenylmethane diisocyanate (MDI), 0.01 part of catalyst, and 0.5 part of white carbon black.
[0044] The preparation steps are as follows:
[0045] (1) Selection of raw materials;
[0046] (2) Stir and mix polypropylene glycol, polytetrahydrofuran diol, polyhexamethylene adipate diol, and antioxidant, heat up to about 120°C, and dehydrate at a vacuum degree of less than 100Pa at 0.5 h;
[0047] (3) Add tackifying resin, continue to heat up to 135-140°C, and dehydrate for 1.5h at a vacuum degree of less than 100Pa;
[0048](4) Cool down to 87°C, add 4,4'-diphenylmethane diisocyanate (MDI) and catalyst, stir, and react for 2 hours at a vacuum degree of less than 100P...
Embodiment 2
[0053] A PTMG modified moisture-curing polyurethane hot-melt adhesive, the following components are taken in parts by mass: 30 parts of polypropylene glycol, 20 parts of polytetrahydrofuran diol, 8 parts of polyadipate-1,6-hexanediol ester diol, 0.5 parts of antioxidant, 15 parts of tackifying resin, 24 parts of 4,4'-diphenylmethane diisocyanate (MDI), 0.01 part of catalyst, 2 parts of silane coupling agent, and 0.49 parts of white carbon black.
[0054] The preparation steps are as follows:
[0055] (1) Selection of raw materials;
[0056] (2) Stir and mix polypropylene glycol, polytetrahydrofuran diol, polyhexamethylene adipate diol, and antioxidant, heat up to about 120°C, and dehydrate at a vacuum degree of less than 100Pa at 0.5 h;
[0057] (3) Add tackifying resin, continue to heat up to 135-140°C, and dehydrate for 1.5h at a vacuum degree of less than 100Pa;
[0058] (4) Cool down to 87°C, add 4,4'-diphenylmethane diisocyanate (MDI) and catalyst, stir, and react for ...
Embodiment 3
[0064] A PTMG modified moisture-curing polyurethane hot-melt adhesive, the following components are taken in parts by mass: 18.99 parts of polypropylene glycol, 30 parts of polytetrahydrofuran diol, 8 parts of poly-1,6-hexanediol adipate, 0.5 parts of antioxidant, 15 parts of tackifying resin, 25 parts of 4,4'-diphenylmethane diisocyanate (MDI), 0.01 part of catalyst, 2 parts of silane coupling agent, and 0.5 parts of white carbon black.
[0065] The preparation steps are as follows:
[0066] (1) Selection of raw materials;
[0067] (2) Stir and mix polypropylene glycol, polytetrahydrofuran diol, polyhexamethylene adipate diol, and antioxidant, heat up to about 120°C, and dehydrate at a vacuum degree of less than 100Pa at 0.5 h;
[0068] (3) Add tackifying resin, continue to heat up to 135-140°C, and dehydrate for 1.5h at a vacuum degree of less than 100Pa;
[0069] (4) Cool down to 87°C, add 4,4'-diphenylmethane diisocyanate (MDI) and catalyst, stir, and react for 2 hours ...
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