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Preparation method of novel high-heat-conductivity metal composite material for electronic packaging

A technology of metal composite materials and high thermal conductivity, which is applied in the field of metal composite materials, can solve the problems that cannot meet the application requirements in the field of electronic packaging, the thermal conductivity of composite materials decreases, and difficult composite materials, etc., to achieve good interface bonding and tissue compactness , Improve wettability and good mechanical strength

Inactive Publication Date: 2015-03-25
CHANGSHU DONGTAO METAL COMPOSITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the extremely poor wettability between diamond and metal materials, it is difficult to directly prepare dense composite materials. At present, the diamond-metal composite materials prepared in China often have large pores, which significantly reduces the thermal conductivity of the composite materials. Meet the application requirements in the field of electronic packaging

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The invention discloses a method for preparing a novel high thermal conductivity metal composite material for electronic packaging, the specific steps are as follows:

[0020] (1) Raw material selection and composite material structure design: diamond is used as the continuous porous phase, B and Wu are used as interface modifiers, and Al and Cu with a mass ratio of 1:1 are used as the metal phase; in the composite material, diamond accounts for 45% of the volume fraction of the composite material, B and Wu account for 5% of the volume fraction of the composite material, and metal Al and Cu copper account for 50% of the volume fraction of the composite material;

[0021] (2) Raw material crushing treatment: Put diamond, B and Wu into a ball mill to grind and mix, and grind for 45 minutes under the condition of a ball-to-material ratio of 25:1, so that the diameter of the mixed material is 60-80 μm, and then dry it for later use; Al , Put the Cu alloy powder into a ball ...

Embodiment 2

[0025] The invention discloses a method for preparing a novel high thermal conductivity metal composite material for electronic packaging, the specific steps are as follows:

[0026] (1) Raw material selection and composite material structure design: diamond is used as the continuous porous phase, B and Wu are used as interface modifiers, and Al and Cu with a mass ratio of 2:1 are used as the metal phase; in the composite material, diamond accounts for 60% of the volume fraction of the composite material, B and Wu account for 10% of the volume fraction of the composite material, and metal Al and Cu copper account for 30% of the volume fraction of the composite material;

[0027] (2) Raw material crushing treatment: Put diamond, B and Wu into a ball mill to grind and mix, and grind for 45 minutes under the condition of a ball-to-material ratio of 25:1, so that the diameter of the mixed material is 60-80 μm, and then dry it for later use; Al , Put the Cu alloy powder into a ball...

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PUM

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Abstract

The invention discloses a preparation method of a novel high-heat-conductivity metal composite material for electronic packaging. The preparation method comprises the following steps: (1) raw material selection and structural design of the composite material; (2) crushing of raw materials; (3) preparation of a diamond blank body; (4) preparation of a diamond / metal composite material. The preparation method disclosed by the invention is simple in technological process, relatively low in preparation cost and capable of precisely and effectively controlling a pore structure of a diamond frame so as to control connectivity, spatial distribution and overall performance of a ceramic phase and a metal phase; by adding B and Ti elements, the wettability of a diamond surface is effectively improved, and the wettability between the diamond blank body and the Al and Cu metals is improved, so that the prepared metal composite material is good in interface associativity and tissue compactness and also has excellent advantages of high heat conductivity, low expansibility, good mechanical strength and the like; the metal composite material for electronic packaging is excellent in comprehensive performances, and is wide in market prospect.

Description

technical field [0001] The invention relates to the field of metal composite materials, in particular to a method for preparing a novel metal composite material with high thermal conductivity for electronic packaging. Background technique [0002] With the continuous development of electronic technology, the degree of integration of electronic components is getting higher and higher, and the heat generation is also increasing. Microprocessors and power semiconductor devices often cannot work normally due to high temperature during application, so high The development of electronic packaging materials with thermal conductivity has become a major bottleneck restricting the development of electronic information technology. In addition, microelectronic packaging materials must not only have high thermal conductivity, but must also have a thermal expansion coefficient that matches that of semiconductor materials. At present, the research mainly focuses on the preparation of high...

Claims

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Application Information

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IPC IPC(8): C22C1/10C22C26/00
Inventor 施建东
Owner CHANGSHU DONGTAO METAL COMPOSITE MATERIAL