Electroplating method with uniform plating thickness and products thereof

Abstract

An electroplating method with a uniform plating thickness includes following steps of: forming a first metal layer on the surface of a non-conductive substrate; processing the first metal layer, namely, dividing the first metal layer into a plurality of electroplating zones disposed at intervals and a non-electroplating zone outside the electroplating zones, with the areas of the electroplating zones being nearly the same, the electroplating zones comprising a first electroplating zone and a second electroplating zone, the first electroplating zone being full of a practical electroplating pattern, and the second electroplating zone comprising a practical electroplating pattern and a virtual electroplating pattern; forming a second metal layer respectively in each of the electroplating zones of the first metal layer by an electroplating manner; removing the non-electroplating zone of the first metal layer; and removing the virtual electroplating pattern part of the first metal layer and the virtual electroplating pattern part of the second metal layer.

Description

technical field [0001] The invention relates to an electroplating method, in particular to an electroplating method with uniform metal coating thickness and its product. Background technique [0002] Electroplating is a method of forming a layer of metal on a conductor using the principle of electrolysis. In addition to electrical conductors, electroplating can also be used on specially treated plastics. The electroplating process is basically as follows: [0003] The metal to be plated is connected to the anode, and the object to be plated is connected to the cathode, and the soluble salt of the metal to be plated is added to the bath to form an electrolyte solution, in which the cathode and anode are immersed in positive ions of the metal to be plated composed electrolyte solution. After the DC power supply is applied, the metal at the anode will release electrons and become positive ions, and the positive ions in the solution will be reduced (get electrons) into atoms ...

AI Technical Summary

Problems solved by technology

However, when it is desired to plate a metal layer on most areas of different sizes on the object to be plated, because under a fixed supply current, different plating areas will cause different current densities, so after the same time of plating process, each The thickness of the metal plating formed on the area will vary greatly

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