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Epoxy resin curing agent, epoxy resin composition, gas barrier adhesive agent, and gas barrier laminate body

A technology of epoxy resin curing and gas-barrier laminated body, which is applied in the direction of epoxy resin glue, synthetic resin layered products, chemical instruments and methods, etc., which can solve the problem of unfavorable operation process of laminated film manufacturing cost and epoxy bonding Problems such as low gas barrier properties of the agent

Inactive Publication Date: 2015-04-01
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the above polyurethane-based adhesives and the epoxy-based adhesive proposed in Patent Document 8 do not have high gas barrier properties. Therefore, when gas barrier properties are required for packaging materials, it is necessary to laminate various gas barrier materials separately. Layer: PVDC coating, polyvinyl alcohol (PVA) coating, ethylene-vinyl alcohol copolymer (EVOH) film layer, m-xylylene adipamide film layer, evaporated aluminum oxide (Al 2 o 3 ), silicon dioxide (SiO 2 ) and other inorganic vapor-deposited film layers, etc., are disadvantageous in terms of the production cost of the laminated film and the operation process in lamination.

Method used

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  • Epoxy resin curing agent, epoxy resin composition, gas barrier adhesive agent, and gas barrier laminate body
  • Epoxy resin curing agent, epoxy resin composition, gas barrier adhesive agent, and gas barrier laminate body
  • Epoxy resin curing agent, epoxy resin composition, gas barrier adhesive agent, and gas barrier laminate body

Examples

Experimental program
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Effect test

Embodiment

[0230] Next, the present invention will be further specifically described with reference to synthesis examples and examples. However, the present invention is not limited by these Examples in any way.

[0231] The method of performance evaluation of the epoxy resin composition (or adhesive agent) and laminated body in the Example and the comparative example was performed as follows.

[0232] 2 ·day·MPa)>

[0233] The oxygen permeability of the laminated film was measured at 23°C and a relative humidity of 60% using an oxygen permeability measuring device (manufactured by Modern Control, OX-TRAN2 / 21).

[0234] 2 ·day·MPa)>

[0235] Using an oxygen permeability measuring device (manufactured by Modern Control Corporation, OX-TRAN2 / 21), the laminated film X produced by the method described in the Examples and Comparative Examples was measured at 23°C and a relative humidity of 60%. , the oxygen permeability of the substrate and the sealing film, and based on the following form...

Synthetic example 1

[0255] (Epoxy Resin Curing Agent A)

[0256] 1 mol of m-xylylenediamine and 0.93 mol of methyl crotonate were put into the reaction container, and stirred at 100° C. for 4 hours under a nitrogen stream. While distilling off generated methanol, the temperature was raised to 165°C, and kept at 165°C for 2.5 hours. A considerable amount of ethanol was added dropwise over 1.5 hours to obtain a solid content concentration of 65%, whereby an epoxy resin curing agent A was obtained.

Synthetic example 2

[0258] (Epoxy Resin Curing Agent B)

[0259] 0.93 mol of crotonic acid and 4.4 mol of water were put into the reaction container. The temperature was raised to 30° C. under a nitrogen stream, and 1 mol of m-xylylenediamine was added dropwise over 1 hour. The temperature was raised to 165° C. while distilling off generated water, and maintained at 165° C. for 2.5 hours. A considerable amount of ethanol was added dropwise over 1.5 hours to obtain a solid content concentration of 65%, whereby an epoxy resin curing agent B was obtained.

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Abstract

Provided are: an epoxy resin curing agent that can cause the realization of high gas barrier properties and favorable adhesion to various plastics, particularly polyesters; an epoxy resin composition; a gas barrier adhesive agent containing the epoxy resin composition; and a gas barrier laminate body and the like having high gas barrier properties and favorable adhesion to various plastics, particularly polyesters. The epoxy resin curing agent is the reaction product of the belowmentioned (A) and (B). Also, the epoxy resin curing agent contains at least an epoxy resin and the epoxy resin curing agent. (A) is meta-xylylene diamine or para-xylylene diamine, and (B) is an unsaturated carboxylic acid represented by formula (1) and / or a derivative thereof (in formula (1), R1 represents an alky group having 1-8 carbon atoms, an aralkyl group having 1-8 carbon atoms, or an aryl group).

Description

technical field [0001] The present invention relates to an epoxy resin curing agent, an epoxy resin composition containing the epoxy resin curing agent, a gas barrier adhesive containing the epoxy resin composition, a gas barrier laminate, and the like. Background technique [0002] Epoxy resins have many excellent properties such as adhesion to various substrates, heat resistance, chemical resistance, electrical properties, and mechanical properties compared to other resins. Therefore, epoxy resins have conventionally been widely used in industrial fields such as coatings for anticorrosion or beautification, adhesives for civil engineering and construction, and the like. Generally speaking, the gas barrier properties of epoxy resin compositions used in the field of coatings and adhesives are better than those using polyurethane resins, acrylic resins, polyolefin resins, etc., but their gas barrier properties It is not comparable to compositions using polyvinylidene chlorid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/44B32B15/08B32B27/38C07C233/38C09J163/00
CPCB32B15/092B32B27/10B32B27/38B32B2307/7242B32B2553/00C07C233/38C08G59/44C08L63/00C09J163/00Y10T428/24802Y10T428/31511Y10T428/31515Y10T428/31529
Inventor 本多荣一河野和起
Owner MITSUBISHI GAS CHEM CO INC