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Electrical level converter for high-speed dynamic random access memory (DRAM)

A level and conversion unit technology, applied in the direction of instruments, static memory, digital memory information, etc., can solve the problems of restricting the speed of DRAM, the difference between rising delay and falling delay, etc.

Active Publication Date: 2015-04-08
XI AN UNIIC SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the technical problem that the rise delay and fall delay of the existing level shifter used in DRAM are very different and restrict the speed of DRAM, the present invention provides a level shifter used in high-speed DRAM

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  • Electrical level converter for high-speed dynamic random access memory (DRAM)
  • Electrical level converter for high-speed dynamic random access memory (DRAM)

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Embodiment Construction

[0012] A level converter used in high-speed DRAM, including a first level conversion unit LS1 and a second level conversion unit LS2, the first level conversion unit includes a p-type MOS transistor p10, a p-type MOS transistor p11, n type MOS transistor n10, n-type MOS transistor n11, inverter inv10, inverter inv11, and inverter inv12, the input signal ls_in is input to the gate terminal of n-type MOS transistor n10, and the input signal ls_in is output through the inverter inv10. The phase input signal ls_in_n and the reverse phase input signal ls_in_n are input to the gate terminal of the n-type MOS transistor n11, the drain terminal of the n-type MOS transistor n10 and the drain terminal of the n-type MOS transistor n11 are both grounded, and the source terminal of the n-type MOS transistor n10, The drain end of the p-type MOS transistor p10 is connected to the gate end of the p-type MOS transistor p11, the source end of the p-type MOS transistor p10 and the source end of t...

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Abstract

The invention relates to an electrical level converter for a high-speed dynamic random access memory (DRAM). The two same electrical level converters and an inverter inv21 are adopted; the technical problems that a great difference between rising delay and falling delay of an existing electrical level converter for the DRAM exists and the speed of the DRAM is restricted are solved. According to the electrical level converter, the rising edge delay and the falling edge delay of a signal out can be completely matched.

Description

technical field [0001] The invention relates to a level shifter used in high-speed DRAM. Background technique [0002] In DRAM, in order to save power, the internal circuit generally works at a lower voltage, such as 1.1v, while the DRAM interface data voltage is relatively high, such as 1.8v. In DRAM, a very critical module is the level shifter (Level-shifter), which is responsible for raising the data from the internal voltage (such as 1.1v) to the interface voltage (such as 1.8v). The rise delay and fall delay of the traditional level shifter Level-shifter are very different, which is also a major bottleneck restricting the speed of DRAM products. Such as figure 1 As shown, the level shifter Level-Shifter of this structure will cause a serious mismatch between rising delay and falling delay. When the input signal ls_in changes from low to high (rising edge), first the n-type MOS transistor (n0) is turned on, the signal ls_out_n becomes low, and then the p-type MOS tran...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/4063H03K19/0175
Inventor 刘海飞
Owner XI AN UNIIC SEMICON CO LTD