BGA molding mold

Abstract

The invention provides a BGA molding mold. The BGA molding mold comprises a mold seat, wherein a plurality of charging barrels are linearly and uniformly distributed in the middle of the mold seat; mold boxes are arranged on the two sides of the charging barrels; each mold box is provided with a plurality of mold cavities which are linearly and uniformly distributed; the arrangement direction of the mold cavities is the same as that of the charging barrels; a mold cavity strip is arranged between every two adjacent mold cavities; each mold box is detachably and fixedly connected with a positioning block which slides towards the corresponding charging barrel; a first positioning needle is inserted into each positioning block; and a second positioning needle is arranged on each mold cavity strip. According to the BGA molding mold, the common round positioning needles are designed and mounted and assist the positioning blocks to adjust the positions, the process is simple and rapid and various problems which can be caused by repeated assembling of the mold do not occur; the BGA molding mold is easy to machine, has a simple structure, occupies a small space and can be adapted to the changes of a base plate size in a certain range; the BGA molding mold is simple to replace, the equipment operation is stable and the cost is low; and meanwhile, various unnecessary debugging mounting risks are reduced, and the production efficiency and the equipment utilization efficiency are greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a BGA molding die. Background technique [0002] In the MOLDING process of semiconductor packaging, due to the particularity of the substrate material, the control accuracy of some of the substrates of different manufacturers and types cannot meet the packaging requirements. The substrate is actually a PCB board, and many dimensions can only be about ±0.1mm. In the MOLDING process, because the smallest particle of the material epoxy resin is smaller than this size, there is a problem of overflow of the molding compound, and the equipment cannot work automatically. [0003] The current measures are to compensate and control the size of different batches of substrates by replacing the eccentric positioning pins, so as to ensure that the gap is smaller than the smallest particle of epoxy resin, and the equipment can work automatically. Such as figure 1 In the posi...

AI Technical Summary

Problems solved by technology

Although in the positioning of BGA molding molds, the needle tip width of the existing eccentric positioning pins can be changed and processed according to the installation pinholes of the positioning pins, but there is a problem that the mold needs to be disassembled and reassembled every time the positioning pins are replaced. At the same time, there are other problems caused by incorrect assembly, etc. In addition, the processing requirements of eccentric positioning pins are high and the cost is high

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