Texturing Auxiliary Agent and Texturing Technology for Polycrystalline Silicon Wafer
A technology of polycrystalline silicon wafers and auxiliary agents, which is applied in the field of optoelectronics, can solve the problems of high cost of texturing, failure to improve efficiency, and inability to provide silicon wafer textured reflectance, etc., and achieve the effect of simple preparation and use process
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Embodiment 1
[0040] Example 1 provides a comparative example, a conventional method without the use of the adjuvant of the present invention.
[0041] Example 1
[0042] Conventional texturing process:
[0043] (a) Acid etching, using chain-type texturing equipment, put silicon wafers into the mixed solution of polycrystalline texturing nitric acid and hydrofluoric acid for acid etching. The acid corrosion temperature is 8℃, and the corrosion time is 100s;
[0044] (b) Rinse with deionized water to clean the remaining acid and organic matter on the surface of the silicon wafer;
[0045] (c) alkaline washing, to remove the porous silicon formed after acid etching, the alkaline washing temperature is controlled at 25°C, and the alkaline washing time is controlled at 30s;
[0046] (d) rinsing with deionized water to clean the remaining alkali on the surface of the silicon wafer;
[0047] (e) pickling, neutralizing alkali washing, alkali remaining on the wafer surface after rinsing, and re...
Embodiment 2
[0058] Adopt the texturing process of the present invention
[0059] Texturing process:
[0060](a) Preparation of surfactant solution: under stirring, dissolve 0.3g perfluoroalkyl carboxylic acid, 0.4g perfluoroalkylamine and 0.5g perfluoroalkyl polyether in 98.8g deionized water (ie: surface The weight percentage of active agent is 1.2%);
[0061] (b) preparation of oxalic acid solution: under stirring, 3 g of oxalic acid is dissolved in 97 g of deionized water (that is, the weight percentage of oxalic acid is 3%);
[0062] (c) Preparation of texturing auxiliary: under stirring, a certain amount of texturing auxiliary is prepared according to the volume ratio. The ratio is: surfactant: oxalic acid: deionized water = 15:25:60;
[0063] (d) Acid etching, using chain texturing equipment, add texturing auxiliary to the mixed solution of polycrystalline texturing nitric acid and hydrofluoric acid, the amount of which is 0.5% of the total volume of the etching solution, and the...
Embodiment 3
[0079] Adopt the texturing process of the present invention
[0080] Texturing process:
[0081] (a) Preparation of surfactant solution: under stirring, dissolve 0.5g perfluoroalkylcarboxylic acid, 0.5g perfluoroalkylamine and 0.5g perfluoroalkylpolyether in 98.5g deionized water (ie: surface The weight percentage of active agent is 1.5%);
[0082] (b) preparation of oxalic acid solution: under stirring, dissolve 3.5 g of oxalic acid in 96.5 g of deionized water (that is, the weight percentage of oxalic acid is 3.5%):
[0083] (c) Preparation of texturing auxiliary: under stirring, a certain amount of texturing auxiliary is prepared according to the volume ratio. The ratio is surfactant: oxalic acid: deionized water = 12:30:58;
[0084] (d) Acid etching, using chain texturing equipment, add texturing auxiliary to the mixed solution of polycrystalline texturing nitric acid and hydrofluoric acid, the amount of which is 0.5% of the total volume of the etching solution, and the...
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Abstract
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