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Texturing Auxiliary Agent and Texturing Technology for Polycrystalline Silicon Wafer

A technology of polycrystalline silicon wafers and auxiliary agents, which is applied in the field of optoelectronics, can solve the problems of high cost of texturing, failure to improve efficiency, and inability to provide silicon wafer textured reflectance, etc., and achieve the effect of simple preparation and use process

Active Publication Date: 2018-06-26
上海太阳能工程技术研究中心有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this patent needs to add a lot of H 2 SO 4 or H 3 PO 4 To achieve the goal of reducing the reflectivity, the cost of texturing is relatively high; moreover, the patented texturing system is an HF-rich system. After texturing, dark lines formed by deep corrosion pits are prone to appear on the surface of silicon wafers, which will affect the photoelectric conversion of solar cells. Efficiency adversely affected
Chinese patent "additive for acidic texturing agent for polycrystalline silicon solar cells" with application number 201010540761.8 and Chinese patent "additive for acidic texturing liquid for polycrystalline silicon wafers and method of use" with application number 201110212876.9 respectively disclose two acidic texturing agents for polycrystalline silicon wafers. Additives for texturing liquid, wherein the additive composition described in the patent with application number 201110112185.1 and the patent with application number 201010540761.8 is H 2 SO 4 、H 3 PO 4 and H 2 O, the application number is 201110212876.9. The auxiliary agent components described in the patent are polyvinylpyrrolidone, triethanolamine and water. What these three patents describe are only to improve the textured surface of polycrystalline silicon wafers and improve the uniformity of corrosion pits. The three patents cannot provide information about the decrease in the reflectivity of the silicon wafer texture after the use of auxiliary agents, let alone the improvement in efficiency after the use of auxiliary agents, so they cannot be used in large-scale production

Method used

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  • Texturing Auxiliary Agent and Texturing Technology for Polycrystalline Silicon Wafer
  • Texturing Auxiliary Agent and Texturing Technology for Polycrystalline Silicon Wafer
  • Texturing Auxiliary Agent and Texturing Technology for Polycrystalline Silicon Wafer

Examples

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Effect test

Embodiment 1

[0040] Example 1 provides a comparative example, a conventional method without the use of the adjuvant of the present invention.

[0041] Example 1

[0042] Conventional texturing process:

[0043] (a) Acid etching, using chain-type texturing equipment, put silicon wafers into the mixed solution of polycrystalline texturing nitric acid and hydrofluoric acid for acid etching. The acid corrosion temperature is 8℃, and the corrosion time is 100s;

[0044] (b) Rinse with deionized water to clean the remaining acid and organic matter on the surface of the silicon wafer;

[0045] (c) alkaline washing, to remove the porous silicon formed after acid etching, the alkaline washing temperature is controlled at 25°C, and the alkaline washing time is controlled at 30s;

[0046] (d) rinsing with deionized water to clean the remaining alkali on the surface of the silicon wafer;

[0047] (e) pickling, neutralizing alkali washing, alkali remaining on the wafer surface after rinsing, and re...

Embodiment 2

[0058] Adopt the texturing process of the present invention

[0059] Texturing process:

[0060](a) Preparation of surfactant solution: under stirring, dissolve 0.3g perfluoroalkyl carboxylic acid, 0.4g perfluoroalkylamine and 0.5g perfluoroalkyl polyether in 98.8g deionized water (ie: surface The weight percentage of active agent is 1.2%);

[0061] (b) preparation of oxalic acid solution: under stirring, 3 g of oxalic acid is dissolved in 97 g of deionized water (that is, the weight percentage of oxalic acid is 3%);

[0062] (c) Preparation of texturing auxiliary: under stirring, a certain amount of texturing auxiliary is prepared according to the volume ratio. The ratio is: surfactant: oxalic acid: deionized water = 15:25:60;

[0063] (d) Acid etching, using chain texturing equipment, add texturing auxiliary to the mixed solution of polycrystalline texturing nitric acid and hydrofluoric acid, the amount of which is 0.5% of the total volume of the etching solution, and the...

Embodiment 3

[0079] Adopt the texturing process of the present invention

[0080] Texturing process:

[0081] (a) Preparation of surfactant solution: under stirring, dissolve 0.5g perfluoroalkylcarboxylic acid, 0.5g perfluoroalkylamine and 0.5g perfluoroalkylpolyether in 98.5g deionized water (ie: surface The weight percentage of active agent is 1.5%);

[0082] (b) preparation of oxalic acid solution: under stirring, dissolve 3.5 g of oxalic acid in 96.5 g of deionized water (that is, the weight percentage of oxalic acid is 3.5%):

[0083] (c) Preparation of texturing auxiliary: under stirring, a certain amount of texturing auxiliary is prepared according to the volume ratio. The ratio is surfactant: oxalic acid: deionized water = 12:30:58;

[0084] (d) Acid etching, using chain texturing equipment, add texturing auxiliary to the mixed solution of polycrystalline texturing nitric acid and hydrofluoric acid, the amount of which is 0.5% of the total volume of the etching solution, and the...

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Abstract

A texturing auxiliary agent for a polycrystalline silicon wafer is prepared from the following components according to the attached volume percentage: 15%-25% of a surfactant solution, 20%-30% of an oxalic acid solution, and 45%-65% of deionized water. A texturing process of the texturing auxiliary agent for the polycrystalline silicon wafer comprises the following steps carried out according to the order: (a) preparing the texturing auxiliary agent; (b), carrying out acid corrosion; (c), carrying out first rinsing with deionized water; (d) washing with an alkali; (e) carrying out second rinsing with deionized water; (f) pickling; (g), carrying out third rinsing with deionized water; and (h) blow-drying. The texturing auxiliary agent has no toxicity and no corrosivity, and is simple in preparation and use process; the texturing auxiliary agent is applied to the texturing process for the polycrystalline silicon wafer, so that the reflectivity of the polycrystalline silicon wafer after texturing is about 4%-5% lower than that of a polycrystalline silicon wafer textured by a conventional texturing process, and the cell efficiency is increased by 0.1%-0.15%.

Description

technical field [0001] The invention relates to optoelectronic technology, in particular to a texturing auxiliary for polycrystalline silicon wafers and a texturing process. Background technique [0002] The surface reflectivity of solar cells is one of the important factors affecting the photoelectric conversion efficiency of solar cells. Textured on the surface of the solar cell can effectively reduce the surface reflectance of the solar cell through texturing, and the incident light is reflected multiple times on the cell surface to prolong the optical path and increase the absorption of infrared photons, and there are more photons in the p-n Photogenerated carriers are generated near the junction, thereby increasing the collection probability of photogenerated carriers; in addition, with the same size substrate, the p-n junction area of ​​the suede battery is larger, which can improve the short-circuit current and the efficiency. [0003] At present, in the industrial p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/24
Inventor 吴新正陈静胡彭年张愿成朱旭张军赵欣侃
Owner 上海太阳能工程技术研究中心有限公司
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