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Substrate transfer device

A technology for conveying devices and substrates, which is applied in the direction of conveyor objects, transportation and packaging, semiconductor devices, etc., and can solve the problems that the accuracy of the substrate cannot be obtained, and the position of the peripheral part of the substrate cannot be properly determined.

Active Publication Date: 2018-10-09
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of transferring such a substrate by the substrate transfer device, the position of the peripheral portion of the substrate cannot be properly determined due to the curl and deformation of the substrate, and therefore, there is a problem that the desired accuracy of substrate transfer cannot be obtained.

Method used

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Examples

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Embodiment Construction

[0023] A substrate transfer device according to an embodiment of the present invention includes a robot arm, a plurality of positioning pads, and at least one support pad.

[0024] The manipulator part has a placing surface for placing the deformable substrate.

[0025] The plurality of positioning pads are provided on the robot arm, and support the periphery of the substrate placed on the placement surface at a first height from the placement surface.

[0026] The at least one support pad is provided on the placement surface, supports the lower surface of the substrate placed on the placement surface, and has a second height higher than the first height.

[0027] In the substrate transfer device described above, when a substrate deformable by its own weight is placed on the placement surface, the substrate is supported by the support pad in a state in which the peripheral portion of the substrate is deformed downward rather than the in-plane central portion. In addition, sin...

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PUM

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Abstract

The present invention provides a substrate transfer apparatus which can improve the accuracy of the substrate is conveyed in conveying deformed by its own weight when the substrate. Substrate conveying means to an embodiment of the present invention (1) having a robot unit (20), a plurality of locating pads (23a, 23b, 23c) and at least one bearing pad (24). Robot unit (20) having a mounting surface (201) can be used to place the substrate is deformed by its own weight (W) of the. A plurality of positioning pads (23a, 23b, 23c) in a self-mounting surface (201) from a first height (H1) supported placing the mounting surface (201) on a substrate (W) of the peripheral edge. At least one support pad (24) disposed on the mounting surface (201), which is supported on the mounting surface is placed (201) on the lower surface of the substrate W, having a higher than the first height (H1) a second height (H2).

Description

technical field [0001] The present invention relates to a substrate transfer device for transferring semiconductor substrates, glass substrates, and the like. Background technique [0002] As a substrate processing apparatus for performing vacuum processing on semiconductor substrates, silicon wafers, glass substrates for liquid crystal display devices, etc., a multi-chamber apparatus is known, which is centered on a transfer chamber and arranged around the transfer chamber through gate valves. A plurality of processing chambers, so that various substrate processing can be continuously performed in vacuum. Such a multi-chamber substrate processing apparatus has a substrate transfer device for automatically loading and unloading substrates from a transfer chamber to each processing chamber. [0003] The substrate transfer device performs telescopic and swivel operations to transfer the substrate to each chamber, and the substrate can be moved relative to the robot arm of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67739H01L21/67742H01L2221/68313H01L21/68785
Inventor 藤井严龟崎厚治江藤谦次佐佐木康次
Owner ULVAC INC