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Cooling module of electronic product

A technology for electronic products and cooling molds, which is applied in the direction of cooling/ventilation/heating transformation, etc. It can solve the problems of excessive heat generation and affect the normal application of electronic products, and achieve the effects of convenient disassembly and maintenance, simple structure, and avoiding damage

Inactive Publication Date: 2015-04-29
CHENGDU LONGTENG ZHONGYUAN INFORMATION TECHCO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: in the existing life, since various electronic products generate more heat, it will seriously affect the normal application of electronic products when they cannot be cooled immediately.

Method used

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  • Cooling module of electronic product
  • Cooling module of electronic product
  • Cooling module of electronic product

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Experimental program
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Embodiment Construction

[0022] see Figure 1 to Figure 3 , shows the electronic product cooling module of the present invention.

[0023] The electronic product cooling module includes a base body 20, the base body 20 is composed of an upper cover 201 and a lower cover 202, and the upper cover 201 is provided with a plurality of parallel air outlets 2011, the lower cover 202 is provided with an annular air inlet 2021, whereby air can enter from the air inlet and be discharged from the air outlet to provide cooling effect for the electronic products placed on the upper casing.

[0024] Wherein, the upper cover 201 and the lower cover 202 are closed to each other to form an internal accommodation space, and a fan 203 is provided in the accommodation space, and the upper and lower covers 202 are respectively equipped with telescopic fans. The track 204 is provided with a plurality of positioning slots 2041 on the telescopic track 204 .

[0025] The lower cover body 202 is provided with a receiving gro...

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Abstract

The invention discloses a cooling module of an electronic product. The cooling module comprises a base main body, wherein the base main body comprises an upper cover body and a lower cover body; a plurality of long strip-shaped air outlets which are arranged in parallel are formed in the upper cover body; an annular air inlet is formed in the lower cover body; the upper cover body and the lower cover body are mutually closed to form an internal accommodation space; a fan is arranged inside the accommodation space; flexible rails are respectively arranged on the peripheries of the upper cover body and the lower cover body; a plurality of positioning card slots are formed in the flexible rails; extending seats are respectively arranged on the two sides of the base main body; the tail ends of the flexible rails are fixedly arranged inside the extending seats; embedded card slots are respectively formed in the positions, corresponding to the flexible rails, of the upper cover body and the lower cover body. The cooling module disclosed by the invention is simple in structure, and convenient to mount, dismount and maintain; the cooling module provides the quick cooling function, enables the heat of the electronic product to be quickly volatized, and avoids damage.

Description

technical field [0001] The invention relates to an electronic product cooling module. Background technique [0002] With the development of science and technology, the scope of use of electronic products is increasing. In people's life and work, the application of electronic products is becoming more and more extensive. The application of electronic products has also become one of the important factors affecting people's life and work. [0003] In existing life, since various electronic products generate more heat, it will seriously affect the normal application of electronic products when they cannot be cooled immediately. [0004] Therefore, in view of the above-mentioned defects, the designers of the present invention research and design a cooling module for electronic products to overcome the above-mentioned defects through painstaking research and design, and comprehensive experience and achievements in related industries for many years. Contents of the invention [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 樊勇龙宁
Owner CHENGDU LONGTENG ZHONGYUAN INFORMATION TECHCO