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Drawing device, exposure drawing device, drawing method, and recording medium storing program

A drawing device and exposed technology, applied in the field of drawing devices, can solve problems such as complex image processing, and achieve the effect of high-precision installation

Active Publication Date: 2017-05-10
ADTEC ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this technique, an image is divided into multiple regions, so there are problems that image processing becomes complicated and that a mechanism for forming positioning holes for connecting circuit patterns between layers is required for each formation region.

Method used

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  • Drawing device, exposure drawing device, drawing method, and recording medium storing program
  • Drawing device, exposure drawing device, drawing method, and recording medium storing program
  • Drawing device, exposure drawing device, drawing method, and recording medium storing program

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach 〕

[0068] Hereinafter, the exposure drawing apparatus of embodiment is demonstrated in detail using drawing. In addition, in this embodiment, a solder resist pattern for drawing a circuit pattern by exposing the present invention to a substrate to be exposed (substrate C to be exposed to be described later) with light beams, and an opening hole for component mounting of a solder resist layer will be described by way of example. In the case of an exposure drawing device for drawing a pattern, etc. Moreover, the substrate C to be exposed is a flat substrate such as a printed wiring board or a glass substrate for a flat panel display.

[0069] like figure 1 and figure 2 As shown, the exposure drawing apparatus 10 of this embodiment is provided with the plate-shaped stage 12 for fixing the board|substrate C to be exposed. A plurality of suction holes for sucking air are provided on the upper surface of the table 12 . Accordingly, when the substrate C to be exposed is placed on t...

no. 2 approach 〕

[0132] Hereinafter, the exposure drawing apparatus 10 which concerns on 2nd Embodiment of this invention is demonstrated.

[0133] The exposure drawing apparatus 10 of 2nd Embodiment is the same as the exposure drawing apparatus 10 of 1st Embodiment, and becomes Figure 1 to Figure 6B structure shown.

[0134] The exposure drawing apparatus 10 of the second embodiment sets limits on the strain correction amount (dx, dy) according to the value of the annular ring when performing correction according to the strain of the substrate C to be exposed. like Figure 14 As shown, the annular ring is an annular area surrounded by the entire circumference of the via hole 68 when the via hole 68 is emptied inside the connection plate 66. The diameter of the connection plate is D, and the annular area when the hole diameter is d The width of , that is, the width L of the annular ring is represented by L=(D-d) / 2.

[0135] Next, refer to Figure 15 , the operation of the exposure drawing...

no. 3 approach 〕

[0157] Hereinafter, the exposure drawing apparatus 10 which concerns on 3rd Embodiment of this invention is demonstrated.

[0158] The exposure drawing apparatus 10 of the third embodiment is the same as the exposure drawing apparatus 10 of the first embodiment and the second embodiment, and becomes Figure 1 to Figure 6B structure shown.

[0159] When the exposure drawing apparatus 10 of the third embodiment performs correction according to the strain of the substrate C to be exposed, the strain correction amount (dx, dy) is reduced according to the adjustment parameter (Mx, My), and the strain is adjusted according to the width L of the annular ring. The correction amount (dx, dy) sets the limit.

[0160] Next, refer to Figure 18 , the operation of the exposure drawing apparatus 10 of this embodiment will be described. also, Figure 18 It is a flowchart showing the flow of processing of the exposure control processing program executed by the system control unit 40 of th...

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Abstract

In the present invention, coordinate data indicating the first positions in a design of a plurality of reference marks that are provided to a substrate to be exposed, coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed that is set using the first positions as a reference, and coordinate data indicating the actual second positions of each of the plurality of reference marks are acquired, a deviation correction amount for correcting the deviation between the first position and the second position is derived for each of the plurality of reference marks, each of the derived deviation correction amounts is reduced by a preset rate, and when drawing the drawing pattern on the substrate to be exposed in accordance with coordinate data that indicates a drawing pattern in which the coordinate data that indicates the second positions is used as a reference, coordinate data indicating the drawing pattern in accordance with the reduced deviation correction amount is corrected.

Description

technical field [0001] The present invention relates to a drawing device, an exposure drawing device, a drawing method, and a recording medium storing a program, in particular to a drawing device for drawing a drawing pattern on a substrate, an exposure drawing device for drawing a drawing pattern on a substrate by exposure, and a drawing for drawing a drawing pattern on a substrate A method and a recording medium storing a program executed by the rendering device described above. Background technique [0002] Conventionally, there is known a multilayer wiring board in which a prepreg obtained by impregnating glass cloth and drying it, a metal plate having excellent rigidity, etc. A multi-layer wiring structure consisting of a resin layer and a wiring layer. In addition, in recent years, thinning and space-saving are required for the multilayer wiring board, and therefore thin multilayer wiring boards having no core layer have been proposed. [0003] In the above-mentioned...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F9/00G03F7/20H01L21/027H05K3/00
CPCG03F9/00H05K3/0005H05K3/341H05K3/4679H05K2203/166G03F7/20H05K3/00
Inventor 菊池浩明
Owner ADTEC ENG