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Metamaterials and their processing methods

A processing method and metamaterial technology, applied in the field of materials, can solve problems such as unproposed solutions, insufficient adhesion, and metamaterial deflection, so as to avoid deflection deformation and delamination, smooth the surface, and increase surface bonding force Effect

Active Publication Date: 2019-08-02
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the insufficient adhesion of many composite materials such as fiber-reinforced resin-based composites to conductive geometries in the related art not only leads to delamination in the processed metamaterial, but also easily leads to the deformation of the metamaterial.
[0005] For the above-mentioned problems in related technologies, no effective solution has been proposed yet

Method used

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  • Metamaterials and their processing methods

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0032] According to an embodiment of the present invention, a method for processing a metamaterial is provided.

[0033] Such as figure 1 As shown, the metamaterial processing method according to the embodiment of the present invention mainly includes step S101 and step S103. Wherein, in step S101, the surface of the metamaterial functional layer is processed to increase the surface bonding force, wherein the metamaterial functional layer includes a dielectric layer and a conductive geometri...

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Abstract

The invention discloses a metamaterial and a processing method thereof. The method comprises the following steps: processing the surface of a metamaterial functional layer to increase surface binding force, wherein the metamaterial functional layer comprises a dielectric layer and a conductive geometric structure located on the dielectric layer; and binding the surface-treated metamaterial functional layer with at least one layer of a composite material. According to the invention, through roughening process of the functional layer, the contact area between the functional layer and the composite material is increased, so the surface binding force between the functional layer and the composite material layer is effectively increased; the surface of the finished metamaterial product can be more smooth; flexural deflection and layering are avoided; and the yield rate of superior products is effectively improved.

Description

technical field [0001] The present invention relates to the field of materials, and in particular, to a metamaterial and a processing method thereof. Background technique [0002] Metamaterials are generally composed of dielectric materials and conductive geometric structures, wherein the conductive geometric structures are arranged in an array along a certain plane or curved surface, and an array is formed as a layer. In the usual metamaterial design, there can be more than one layer of microstructures, and the multilayer microstructures are scattered in the dielectric material according to certain rules, and the multilayer microstructures do not intersect each other. [0003] Fiber-reinforced resin-based composites have excellent mechanical properties, and their dielectric properties can also be adjusted within a certain range according to design requirements, so they are often used as dielectric materials to form metamaterials. [0004] However, the insufficient adhesion...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B38/00B32B27/06B29C71/00C08J7/00
CPCB29C71/00B32B38/00B32B2038/0052C08J7/00
Inventor 不公告发明人
Owner KUANG CHI INST OF ADVANCED TECH