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Preparation method of three-dimensional heat dissipation circuit board

A circuit board and three-dimensional technology, which is applied in the field of preparation of three-dimensional heat dissipation circuit boards, can solve the problems of limited improvement of heat dissipation effect, lengthy assembly process, uneven heat transfer of LED light source and radiator, etc., achieve high thermal conductivity and reduce thermal resistance. Effect

Active Publication Date: 2018-11-09
江苏煊葳光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Taking LED light bulbs as an example, the heat sink is assembled with screws and the LED circuit board. After heating up, it expands and contracts with heat, resulting in uneven heat transfer between the LED light source and the heat sink. The improvement of heat dissipation effect is limited, and the assembly process of this structure is relatively lengthy.

Method used

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  • Preparation method of three-dimensional heat dissipation circuit board
  • Preparation method of three-dimensional heat dissipation circuit board
  • Preparation method of three-dimensional heat dissipation circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] ginseng image 3 , In this embodiment, partial anodic oxidation is used to make the insulating layer.

[0041] The non-circuit area of ​​the substrate 11 is pasted with adhesive tape or screen printing glue. Glue can be epoxy resin, also can be silicone or other high molecular compound. Other conventional anti-plating treatment methods can also be used to achieve the effect of shielding non-circuit areas. Putting it into a sulfuric acid solution, using the substrate 11 as the anode and the carbon rod as the cathode, anodic oxidation is performed to form an insulating layer 13 on a part of the substrate 11 (ie, the circuit area).

[0042] A conductive medium is printed on the surface of the partial substrate after anodic oxidation by stencil printing or screen printing technology, and the conductive medium is cured on the substrate through baking or UV curing to form the circuit layer 15 . The conductive medium includes but not limited to copper glue, copper paste, co...

Embodiment 2

[0047] ginseng Figure 4 , The difference between this example and Example 1 is that the insulating layer is made by partial micro-arc oxidation.

[0048] The cut substrate 11 is pasted with adhesive tape or screen printing glue on the non-circuit area, and the substrate 11 is put into hydrochloric acid solution for micro-arc oxidation, so that the insulating layer 13 is partially formed on the substrate. Other steps are the same as in Embodiment 1.

Embodiment 3

[0050] ginseng Figure 5 In this embodiment, the substrate 11 is first cut and bent into a three-dimensional structure in the non-circuit area, and then the insulating layer 13, the printed circuit layer 15 and the surface ink layer 17 are sequentially fabricated on the three-dimensional substrate 11 by the aforementioned method.

[0051] The three-dimensional heat dissipation circuit board prepared by the method of the present application has high thermal conductivity, and the installation of the heat sink can be omitted. Moreover, the above method only prints the conductive medium for the position where the circuit is needed, which overcomes the defects of large waste and high pollution of the copper foil etching method.

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Abstract

The invention discloses a three-dimensional heat-dissipating circuit board and a preparation method of the three-dimensional heat-dissipating circuit board. The method includes the following steps: substrate cutting, substrate insulation, conducting medium printing, and surface ink printing on the surface of a conducting medium. The steps of the substrate insulation are: conducting oxygen covering treatment on a non-circuit area of the substrate surface, and conducting oxidization on a circuit area of the substrate surface to prepare an insulation layer. The preparation method further includes the step of bending formation of the non-circuit area. The three-dimensional heat-dissipating circuit board is machined and formed to be a three-dimensional structure, is high in heat-dissipating coefficient, and capable of reducing the generation of thermal resistance without the need of a radiator by means of the prepared LED lamp or 3C products.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to a preparation method of a three-dimensional heat dissipation circuit board. Background technique [0002] The circuit board includes a substrate, an insulating layer and a circuit layer. One of two methods is usually used to make the insulating layer: one is to coat insulating glue with insulating and thermally conductive polymer as the main component, and the other is to do anodic oxidation or micro-arc oxidation on the substrate. The thermal conductivity of insulating glue is not high, while anodic oxidation or micro-arc oxidation treatment has good heat dissipation effect and high heat dissipation coefficient. However, the circuit boards made by the two methods are of planar structure, and the LED lamps or 3C products made need to be added under the planar substrate. Install the radiator to assemble with other components. Taking LED light bulbs as an examp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00
Inventor 王子欣刘昱宏严红波汪有志
Owner 江苏煊葳光电科技有限公司
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