Conductive adhesive
A conductive and adhesive technology, used in conductive adhesives, adhesives, conductive materials, etc., can solve the problems of poor stress relaxation, high price, lack of stress relaxation characteristics and heat resistance characteristics, etc., to achieve high stress relaxation Effect
Active Publication Date: 2015-05-13
SUMITOMO METAL MINING CO LTD
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Problems solved by technology
However, Au-Si based solders have the problems of high price of gold (Au), lack of stress relaxation properties and heat resistance properties, and high operating temperature.
On the one hand, there is a problem in Sn-Pb based solder that lead (Pb) is harmful to the human body, and its use is restricted in consideration of its impact on the environment
However, this conductive adhesive has problems in that heat resistance is insufficient, and the bonding of the organic resin is destroyed by heat treatment at 200°C to 300°C, resulting in an excessive decrease in adhesiveness.
However, the curing temperature of the conductive adhesive is also higher than the heat-resistant temperature of the organic resin substrate, and the cured product after the curing reaction has an extremely rigid (rigid) structure, and it is easy to break when subjected to mechanical shock or thermal shock. Cracks occur, and the stress relaxation after curing is poor, so it is difficult to apply to wiring boards
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1～16、 comparative example 1～10
[0078] As the composition of the conductive adhesive, the conductive powder described in Table 1, epoxy resin, thermoplastic phenolic resin, curing accelerator, organic liquid component, additive, and ceramic powder were prepared. The content of each composition was adjusted as described in Table 2, and kneaded using a three-roll kneader (Inoue Seisakusho Co., Ltd.) to obtain a conductive adhesive. Table 2 shows the temperature and kneading time of the composition at this time. In addition, in Example 7 and Example 8, oleic acid was added in order to prevent oxidation of the nickel powder or silver-coated nickel powder used as the conductive powder, while in Example 9, the For the purpose of adjusting the viscosity of the agent, ceramic powder (silica powder) is also added.
[0079] The viscosity of the conductive adhesive thus obtained was measured using an HBT-type viscometer (manufactured by Brookfield). In addition, the curing temperature and curing time were measured us...
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Abstract
[Problem] To provide a conductive adhesive which is provided with heat resistance against heat treatments that are performed within the temperature range of 200-300°C, while having a curing temperature that is lower than the upper temperature limit of an organic resin substrate and being prevented from the occurrence of cracks after a curing reaction. [Solution] This conductive adhesive is obtained by adjusting the contents of respective constituents so that the conductive adhesive contains 60-92% by mass of a conductive powder, 1-25% by mass of an epoxy resin, 0.1-20% by mass of a thermoplastic phenolic resin that has a number average molecular weight of 1,000-5,000, 0.01-5% by mass of a curing accelerator and 2-35% by mass of an organic liquid component and by kneading these constituents for 0.2-10 hours, while maintaining the temperature of these constituents within the range of 0-40°C.
Description
technical field [0001] The present invention relates to a conductive adhesive used when adhering semiconductor elements or chip components to a substrate such as a lead frame or when forming wiring on a substrate. Background technique [0002] Conventionally, when bonding chip components such as semiconductor elements, chip resistors, and chip LEDs on substrates such as lead frames, printed wiring boards (PWB), and flexible printed circuit boards (FPC) to conduct electrical or thermal conduction, Usually Au-Si based solder or Sn-Pb based solder is used. However, Au-Si based solders have problems in that gold (Au) is expensive, lacks stress relaxation properties and heat resistance properties, and has a high operating temperature. On the one hand, the Sn—Pb based solder has a problem that lead (Pb) is harmful to the human body, and its use is restricted in consideration of its impact on the environment. Therefore, it has become mainstream to use a conductive adhesive instea...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C09J163/00C09J9/02C09J11/04C09J11/06C09J161/04H01B1/00H01B1/22H01B13/00
CPCH01B1/22C08G59/621C08K3/08C08K9/02C08K2003/0806C08K2003/0831C08K2003/085C08K2003/0862C08L63/00C09J9/02C09J161/06
Inventor 田中政史向井哲也小山宏
Owner SUMITOMO METAL MINING CO LTD