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Film laminating mechanism used for plastic package system

A film covering mechanism and film technology, which is applied in the direction of lamination system, lamination device, lamination, etc., can solve the problems of shortening the service life of the mold, damage, pollution of the mold base, etc., to improve work efficiency, prolong the service life, prevent The effect of indentation or scratching

Active Publication Date: 2015-05-20
TONGLING FUSHI SANJIA MACHINE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the electronic device in the plastic packaging system in the prior art may cause damage to the chip when it is directly in contact with the mold frame. The chip may be damaged when the chip is packaged in the mold frame and then demoulded, and the mold frame is easily polluted by the molding compound. Cleaning needs to be cleaned, increasing labor intensity, reducing equipment capacity, and shortening the service life of molds

Method used

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  • Film laminating mechanism used for plastic package system
  • Film laminating mechanism used for plastic package system
  • Film laminating mechanism used for plastic package system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Embodiment 1 of the film covering mechanism in the present invention: a film covering mechanism used in a plastic sealing system, including a film winding module, a static elimination module 14, a demoulding module 15 and a vacuum adsorption module 16, and the film winding module includes a film The winding device, the film winding device includes a motor and a main shaft for winding the film 11, the main shaft is connected with the motor transmission, the stripping module 15 includes a demoulding device, and the demoulding device includes a cylinder and a laminating roller connected to the piston rod of the cylinder , the film laminating roller, the static elimination module 14 and the vacuum adsorption module 16 are located above or below the travel path of the film 11 .

[0045] In this embodiment, it is possible to store the film in advance by setting the rotating shaft of the fixed film 11 or by setting two film winding devices, one of which is used to store the fil...

Embodiment 2

[0070] Embodiment 2 of the plastic sealing press among the present invention: comprise press frame 2, upper die frame 3, lower die frame 4 and press 5, it also comprises the film covering mechanism 1 in the embodiment 2 of film covering mechanism, The two film winding devices of the laminating mechanism are located on both sides of the upper mold frame 3 in the press, and are symmetrically distributed, and the two demoulding devices are connected with the corresponding film winding devices, so that the two demoulding devices are also located on the upper side of the press. Both sides of the formwork 3 are symmetrically distributed, the motor of each film winding device is fixedly connected to the press frame 2, and the main shaft of each film winding device is movably connected to the press frame 2;

[0071] When the plastic sealing press is started, the main shaft of the film winding device of the laminating mechanism drives the film 11 so that the travel route of the film 11 ...

Embodiment 3

[0074] Embodiment 3 of the plastic sealing press in the present invention: includes press frame 2, upper die frame 3, lower die frame 4 and press 5, and it also includes any one of the embodiments 3 to 7 of the lamination mechanism The laminating mechanism 1;

[0075] The film conveying device 12 and the film winding device 13 in the laminating mechanism are respectively located on both sides of the upper mold frame 3 and are symmetrically distributed;

[0076] The first fixed plate 152 of the first demoulding device is connected to the film conveying device 12 and the second fixed plate 157 of the second demoulding device is the film winding device 13, so that the 2 demoulding devices are also located on the upper mold frame 3 in the press The two sides are symmetrically distributed;

[0077] When the plastic sealing press is started, after the film conveying device 12 sends out the film 11, the film 11 sent out is tensioned under the first tensioning shaft 129 and then pass...

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Abstract

The invention discloses a film laminating mechanism used for a plastic package system. The film laminating mechanism comprises a thin film winding module, an electrostatic elimination module, a de-molding module and a vacuum adsorption module, wherein the thin film winding module comprises a thin film winding device; the thin film winding device comprises a motor and a main shaft for winding a thin film; the main shaft is in transmission connection with the motor; the de-molding module comprises a de-molding device; the de-molding device comprises an air cylinder and a film laminating roller connected with a piston rod of the air cylinder; and the film laminating roller, the electrostatic elimination module and the vacuum adsorption module are located above or below a thin film feeding path. The invention further discloses a plastic package pressing machine with the film laminating mechanism. The plastic package pressing machine uses the film laminating mechanism; when the plastic package pressing machine is used, one layer of special plastic thin film is arranged between a chip to be packaged and a formwork by the film laminating mechanism; in a packaging process, a thin film plastic package material and the formwork are separated and the formwork is prevented from being polluted by the thin film plastic package material; and the formwork is prevented from being in direct contact with an electronic device. The formwork keeps clean, the working efficiency is improved and the service life of a mold of the plastic package pressing machine is prolonged.

Description

technical field [0001] The invention relates to a film covering mechanism, which is a film covering mechanism used for a plastic sealing press in a plastic sealing system. Background technique [0002] In integrated circuit chip packaging, there are mainly two methods: transfer molding and compression molding. In transfer molding, the plastic packaging materials used are generally cylindrical solid particle resin materials. The resin particles flow into the mold base under the action of temperature and pressure to cover the chips that have completed the previous wire bonding process. A plastic layer is formed on the surface to protect the chip from damage. The raw materials for compression molding are generally powder or liquid materials, which are uniformly covered on the surface of the chip through a special powder spraying or dispensing mechanism, and then transferred to the compression mold base, where the film is laminated and sealed under pressure. Since the molding ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B39/00
CPCB32B37/10B32B39/00
Inventor 张青松陈迎志汪洋杨亚萍徐善林曹玉堂
Owner TONGLING FUSHI SANJIA MACHINE