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Positive-type photosensitive resin composition, photosensitive resin film produced using same, and display device

A technology of photosensitive resin and composition, applied in the direction of photosensitive materials, optics, and optomechanical equipment for optomechanical equipment, can solve problems such as pattern decay of organic light-emitting diodes, and achieve the effect of excellent heat resistance and chemical resistance

Active Publication Date: 2020-05-26
SAMSUNG SDI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Specifically, when forming fine structures such as insulating layers, planarization layers, etc., organic light emitting diodes may have a problem of pattern degradation during thermal curing.

Method used

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  • Positive-type photosensitive resin composition, photosensitive resin film produced using same, and display device
  • Positive-type photosensitive resin composition, photosensitive resin film produced using same, and display device
  • Positive-type photosensitive resin composition, photosensitive resin film produced using same, and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0215] [Synthesis Example 1] Synthesis of Polybenzoxazole Precursor (PA-1)

[0216] 17.4 g of 2,2-bis(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane and 0.86 g of 1,3-bis(aminopropyl) Tetramethyldisiloxane is placed in a four-necked flask equipped with a stirrer, a temperature regulator, a nitrogen injector and a cooler, while nitrogen is passed through the flask, and 280 g of N-methyl-2-pyrrolidone is added thereto (NMP) to dissolve the mixture. Here, the solution obtained included a solids content of 9% by weight.

[0217] When the solid was completely dissolved in the solution, 9.9 g of pyridine was added thereto, and slowly added thereto by dissolving 13.3 g of 4,4'-oxodibenzoyl chloride in 142 g of N-methyl - The obtained solution in 2-pyrrolidone (NMP) while keeping the mixture at 0°C to 5°C. After the addition in a dropwise manner, the reaction was performed at 0 to 5° C. for one hour and then the reaction was further performed for one hour after raising its ...

Embodiment 2

[0219] [Synthesis Example 2] Synthesis of Polybenzoxazole Precursor (PA-2)

[0220] A polybenzoxazole precursor (PA-2) was prepared according to the same method as in Synthesis Example 1 except that maleic anhydride was used instead of 5-norbornene-2,3-dicarboxylic anhydride.

Embodiment 3

[0221] [Synthesis Example 3] Synthesis of Polybenzoxazole Precursor (PA-3)

[0222] A polybenzoxazole precursor (PA-3) was prepared according to the same method as in Synthesis Example 1 except that aconitic anhydride was used instead of 5-norbornene-2,3-dicarboxylic anhydride.

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Abstract

Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.

Description

[0001] References to related applications [0002] This application claims priority and benefit from Korean Patent Application No. 10-2013-0159304 filed in the Korean Intellectual Property Office on December 19, 2013, the entire contents of which are incorporated herein by reference. technical field [0003] The present disclosure relates to a positive photosensitive resin composition, a photosensitive resin film manufactured using the same, and a display device including the photosensitive resin film. Background technique [0004] Heat-resistant resins such as polyimide, polybenzoxazole, etc. have been widely used as interlayer insulating layers or planarization layers of display devices such as organic light emitting diodes, LCDs, and the like. In particular, heat-resistant photosensitive polyimide and photosensitive polybenzoxazole have recently been used to form an interlayer insulating layer of an organic light emitting diode (OLED) and the like to ensure reliability of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/022
CPCG03F7/0233G03F7/0758G03F7/023G03F7/039C08G73/10C08G73/22G03F7/0226
Inventor 李种和权志伦金尚洙卢健培朴银碧白载烈李范珍李相行黄银夏
Owner SAMSUNG SDI CO LTD
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