Piece insertion and wave soldering passing method and printed circuit board
A printed circuit board and wave soldering technology, which is applied in the directions of printed circuits, printed circuits, and assembling printed circuits with electrical components, and can solve problems such as poor component soldering
Inactive Publication Date: 2015-06-24
SHENZHEN GONGJIN ELECTRONICS CO LTD
View PDF4 Cites 4 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] Based on this, in order to solve the problem of poor soldering of some soldered components after automatic plug-in and wave soldering, it is necessary to provide a method for plug-in and wave soldering
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0018] In order to make the objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0019] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.
[0020] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a piece insertion and wave soldering passing method. The piece insertion and wave soldering passing method comprises the following steps that a substrate is provided; the substrate is drilled to form at least one set of soldering holes, and each set of soldering holes comprise the oval hole and the circular hole; a bonding pad surrounding each soldering hole is formed on the part, on the periphery of each soldering hole, on the substrate, and the bonding pads surround the oval holes are in an oval shape; piece insertion is conducted so that circuit elements can be inserted into the soldering holes, and each circuit element comprises two pins and an element body with the circular cross section, wherein the two pins are inserted into the oval hole and the circular hole of the corresponding set of soldering holes respectively, the element body is vertically inserted, and one end of the element body abuts against the oval hole; the pins are sheared after piece insertion is completed, and the parts, penetrating out of the soldering holes, of the pins are bent to fix the circuit elements; wave soldering passing is conducted. The invention further discloses a printed circuit board. According to the piece insertion and wave soldering passing method and the printed circuit board, the circular soldering holes in the traditional technology are transformed into the oval holes, the phenomenon that soldering surfaces are prone to damage due to the fact that air overflows from the lower portion can be avoided, and thus the soldering quality is ensured.
Description
technical field [0001] The invention relates to the field of printed circuits, in particular to a method for plug-in and wave soldering, and also to a printed circuit board. Background technique [0002] Due to rising labor costs, more and more products are plugged in automatically. However, it was found in production that after automatic plug-in and wave soldering, some soldered components may have poor soldering. Contents of the invention [0003] Based on this, in order to solve the problem of poor soldering of some soldered components after automatic plug-in and wave soldering, it is necessary to provide a method for plug-in and wave soldering. [0004] A method for plug-in and wave soldering, comprising the following steps: providing a substrate; drilling holes on the substrate to form at least one group of soldering holes, each group of soldering holes includes an oval hole and a circular hole; A soldering pad surrounding the soldering hole is formed on the substra...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K3/34H05K1/11
CPCH05K1/113H05K1/116H05K3/3447H05K2201/0939H05K2203/044
Inventor 王达国王远胡倩倩
Owner SHENZHEN GONGJIN ELECTRONICS CO LTD