A high-power LED lamp with a heat-conducting composite medium layer
A technology of LED lamps and heat conduction compounding, which is applied in the direction of lighting and heating equipment, parts of lighting devices, semiconductor devices of light-emitting elements, etc., can solve the problems of increasing product weight, unsatisfactory heat dissipation effect, and increasing costs. Long life, high luminous efficiency, fast heat dissipation effect
Active Publication Date: 2017-07-04
ZHEJIANG LEUCHTEK ELECTRONICS
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Problems solved by technology
The common practice is to increase the heat sink. In this way, not only the heat dissipation effect is not ideal, but also the weight of the product is increased, and the cost is increased.
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[0030] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention. see Figure 1 to Figure 5 , the present invention will be described in detail below in conjunction with the accompanying drawings.
[0031] The present invention provides a high-power LED lamp with a heat-conducting composite medium layer, including a radiator 1, a high-power LED light source 2 and a light-transmitting plate 3, and the high-power LED light source 2 and the light-transmitting plate 3 are stacked up and down in sequence fixed under the radiator 1, such as figure 2 As shown, screw holes are provided around the light-transmitting plate 3 , and the present invention uses screws to fix the light-transmitting plate 3 under the heat sink 1 and encapsulate the high-power LED light so...
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The invention relates to the technical field of high-power LED lamps, in particular to a high-power LED lamp with heat conduction compound dielectric layers. The high-power LED lamp with the heat conduction compound dielectric layers comprises a radiator, high-power LED light sources and light-admitting plates, the high-power LED light sources and the light-admitting plates are sequentially fixed below the radiator in an up-down overlapped mode, the radiator and the high-power LED light sources are each provided with a heat conduction compound dielectric layer, and each heat conduction compound dielectric layer is formed by pressing at least a copper dielectric layer and an aluminum dielectric layer in a fitting mode; during assembly, the copper dielectric layers are attached to the back surfaces of the high-power LED light sources, and the aluminum dielectric layers are attached to the lower surface of the radiator. During the working process, heat generated by the high-power LED light sources is educed to the heat conduction compound dielectric layers rapidly, and the heat is conducted to the radiator through the heat conduction compound dielectric layers, so that a heat transmission channel is always in forward direction transmission to the outside, and the heat is not accumulated on an LED chip; under the same conditions, the high-power LED lamp with the heat conduction compound dielectric layers has the advantages that the heat dissipation is rapid, the luminous efficiency of the lamp is high, and the service life is long.
Description
technical field [0001] The invention relates to the technical field of high-power LED lamps, in particular to a high-power LED lamp with a heat-conducting composite medium layer. Background technique [0002] As we all know, high-power LED lamps need to emit a lot of heat when they work. If the heat dissipation is not smooth, the performance and service life of LED lamps will be seriously affected. Since the LED chip is very sensitive to temperature, the higher the junction temperature, the greater the light decay and the shorter the life. For high-power LED lamps, the heat of the light source is concentrated, and within a unit area, the heat dissipation speed of high-power LED lamps remains unchanged, while high-power LED lamps generate more and more heat during operation, resulting in part of the heat generated being absorbed Accumulated on the LED lamp board, so the heat of the high-power LED lamp is not dissipated effectively for a long time, which will lead to the rapi...
Claims
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IPC IPC(8): F21K9/20F21V29/71F21V29/85F21V19/00F21V29/70F21V21/104F21V21/30F21Y115/10
CPCF21S2/00F21V17/104F21V17/12F21V19/001F21V21/30
Inventor 刘军
Owner ZHEJIANG LEUCHTEK ELECTRONICS