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Method for compensating the influence of organic polymer plasma etching process error on devices

A compensation method, plasma technology, applied in the field of optical communication

Inactive Publication Date: 2015-07-22
JILIN NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The speed of photoelectric conversion and electronic equipment limits the improvement of switching capacity, which forms the so-called "electronic bottleneck". This processing mode prevents the bandwidth advantage of optical fiber communication from being brought into play.

Method used

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  • Method for compensating the influence of organic polymer plasma etching process error on devices
  • Method for compensating the influence of organic polymer plasma etching process error on devices
  • Method for compensating the influence of organic polymer plasma etching process error on devices

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Embodiment Construction

[0012] In a specific embodiment of the present invention, the optical waveguide device prepared by the organic polymer plasma etching process is mainly composed of a rectangular waveguide, and the optical waveguide device is generally a micron structure, and the nanometer error, the main error comes from the layout of the theoretical design and the sample after production The error between the central wavelength of the organic polymer in this example = 1550.918 nm, waveguide width a = 6 μm, thickness b = 4 μm, waveguide core refractive index n 1 = 1.51, cladding index of refraction n 2 = 1.4979, using the hyperbolic function expression (1) to simulate, where b(x) is the expression of the waveguide thickness, a is the waveguide width, and c is the hyperbolic influence factor:

[0013] . (1)

[0014] When c takes different values, the effect is as follows image 3 , when the impact factor c = 0.2 , the curve is most consistent with the cross-section of the ...

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Abstract

Provided is a method for compensating the influence of organic polymer plasma etching process error on devices. The error between a theoretically designed layout and a manufactured sample is corrected by a perturbation analysis method through design optimization and process condition adjustment, so that the error between the theoretically designed layout and the manufactured sample can be eliminated. The invention opens up a new road for improving the technological process of polymer electro-optic materials, increasing the level of technology, and preparing a high-performance and low-cost polymer optoelectronic device. The method of the invention can be widely used as a method for correcting the influence of the process error caused by polymer plasma etching on the performance of devices.

Description

Technical field: [0001] The invention relates to the design and manufacture of optical waveguide devices in the field of optical communication, in particular to a method for compensating the influence of process errors caused by polymer plasma etching process on device performance from two aspects of optimizing design and adjusting process preparation conditions. Background technique: [0002] As humans gradually enter the information society, the demand for communication services continues to surge, and the huge potential bandwidth capacity of optical fibers of nearly 30 THz makes optical fiber communication the most important support. At present, the information transmitted by optical fiber must go through optical / electrical conversion at the node, rely on electronic equipment for interconnection and exchange, and then convert the electrical signal into an optical signal for downward transmission. The speed of photoelectric conversion and electronic equipment limits the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/136
CPCG02B6/136
Inventor 秦政坤王国峰汪玉海宋明星
Owner JILIN NORMAL UNIV