Device having heat sink
A radiator and equipment technology, applied in mechanical equipment, circuit heating devices, machines/engines, etc., can solve the problems of reduced cruising distance and increased power consumption, and achieve the effect of suppressing costs and promoting miniaturization
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no. 1 Embodiment approach
[0094] figure 1 The illustrated electric compressor 1 constitutes an air conditioner mounted on a vehicle. The electric compressor 1 has: an electric motor 10; a scroll compression mechanism 11 that is rotated by the output of the electric motor 10; a casing (main body housing portion) 12 for accommodating them; The circuit housing part 30 integrated with the body 12.
[0095] The electric compressor 1 is installed on the vehicle so that the rotating shaft 15 rotated by the electric motor 10 is oriented horizontally.
[0096] The motor 10 has a rotor 13 and a stator 14 . The rotation of the rotor 13 is output to the rotary shaft 15 . In addition, in this embodiment, although the AC induction motor was used as the motor 10, it is not limited to this, For example, a DC brushless motor, a switched reluctance motor, etc. may be used.
[0097] The scroll compression mechanism 11 has: a fixed scroll portion 16 fixed to the housing 12 ; and an orbiting scroll portion 17 provided ...
no. 2 Embodiment approach
[0144] Next, a compressor according to a second embodiment of the present invention will be described.
[0145] In addition, in the following description, the structure different from 1st Embodiment is mainly demonstrated, and the same structure as already demonstrated is attached|subjected with the same code|symbol, and description is abbreviate|omitted.
[0146] Such as Figure 4 As shown in (a), in the second embodiment, two heat sinks 51 and 52 are used. The heat sinks 51 and 52 are formed by roughly dividing the heat sink 36 of the first embodiment into two in the vertical direction. Accordingly, each column of the heat sinks 51 and 52 undertakes the heat dissipation of the semiconductor element 43 . That is, the heat sink 51 corresponds to a section in which the semiconductor elements 43 forming one column are arranged, and the heat sink 52 corresponds to a section in which the semiconductor elements 43 forming the other column are arranged.
[0147] Both of the heat ...
no. 3 Embodiment approach
[0157] Next, a third embodiment of the present invention will be described.
[0158] Such as Figure 5 As shown in (a) and (b), in the third embodiment, the protruding portion 61 protruding from the partition wall 32 is provided above the heat sinks 51 and 52 .
[0159] Protrusion 61 such as Figure 5 As shown in (a), it extends in the horizontal direction on the surface 32A of the partition wall 32 . The dimension in the horizontal direction of the protruding portion 61 is approximately from the tip T of the radiator 51 to the tip T of the radiator 52 .
[0160] The height of the protruding portion 61 is set to be equal to the height of the boss 37 of the fixed power substrate 41 in this embodiment.
[0161] Protrusion 61 such as Figure 5 As shown in (b), the recessed part 610 is enclosed, and this recessed part 610 is made into the form dug in from the back surface 32B of the partition wall 32. As shown in FIG. The protruding portion 61 is maintained at the same low te...
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