Probe device with spring-loaded sleeve probe

Abstract

The invention relates to a probe device, comprising a spring sleeve type probe and a probe holder, the probe has a needle body and a spring sleeve, the spring sleeve has at least one spring section and a spring sleeve fixed on the needle body The joint part has a protrusion protruding from the outer cylinder surface of the spring section, and the probe base has a plurality of stacked guide plates and at least one guide hole for the probe to pass through, including a lower guide plate 1. A support guide plate located above the lower guide plate and a support hole located on the support guide plate, the support hole is non-circular and can define a center, a guide surface and a support surface, and the distance between the support surface and the center is greater than the outside of the spring section The radius of the cylinder surface, the distance between the guide surface and the center is greater than the distance between the support surface and the center, and greater than the maximum distance between the protrusion and the center of the needle body; thus, when the probe is stressed, it can avoid excessive deflection or distortion.

Description

technical field [0001] The present invention relates to a probe device, in particular to a probe device with a spring sleeve type probe. Background technique [0002] When the semiconductor chip is tested, the testing machine is electrically connected to the object under test through a probe card, and obtains the test result of the object under test through signal transmission and signal analysis. A conventional probe card usually consists of a circuit board and a probe device, or further includes a space converter arranged between the circuit board and the probe device, and the probe device is provided with a plurality of corresponding The probes are arranged for the electrical contacts of the object to be tested, so as to pass through these probes and touch the electrical contacts at the same time. [0003] figure 1 It is an exploded plan view of a conventional spring sleeve type probe 11 . The probe 11 includes a needle body 12 and a spring sleeve 13 set outside the nee...

AI Technical Summary

Problems solved by technology

[0007] Since the needle diameter of the above-mentioned spring sleeve type probe 11 is quite small (usually between tens of micrometers and more than one hundred micrometers), and the aspect ratio is quite large (usually between 10:1 and 100:1), and , the spring sleeve 13 has a considerable distance from the inner wall of the mounting hole 174 except that each protruding portion 134 is relatively close to the inner wall of the mounting hole 174. Therefore, the probe 11 is stressed at the bottom of the needle body 12 It is easy to cause the needle body to deflect and twist, such as image 3 As shown, this will not only cause problems such as inaccurate alignment and unstable needle pressure, but also easily cause the probe to break. Moreover, once the probe breaks, it will cause problems such as maintenance and replacement.

[0008] In addition, the position of the joint 176 between the upper guide plate 171 and the middle guide plate 172 corresponds to one of the spring segments 138 of the spring sleeve 13, and the position of the joint 177 between the middle guide plate 172 and the lower guide plate 173 also corresponds to another spring of the spring sleeve 13. Section 138, if these guide plates 171, 172, 173 cause their joints 176, 177 to be non-flush with each other due to assembly errors, and then cause the inner wall surface of the mounting hole 174 to be uneven, each spring section 138 is easy to contact each joint due to uneven contact. 176, 177 and get stuck, so that the probe 11 needs to be repaired, and the maintenance is difficult and time-consuming.

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