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Flake-type oxygen sensor and preparation method thereof

An oxygen sensor, chip technology, applied in the field of sensors, can solve the problems of scrapped samples, short service life, cracking of chip oxygen sensors, etc., and achieve the effect of not easy to crack and improve service life

Inactive Publication Date: 2015-09-02
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the traditional chip oxygen sensor is sintered, due to the inconsistent shrinkage parameters between the layers of the chip oxygen sensor, it is easy to cause the chip oxygen sensor to crack, resulting in the sample being scrapped. In addition, when the traditional chip oxygen sensor works at high and low temperatures, Due to the different expansion rates between the layers of the device, the device is prone to cracking and failure during the working process, and the service life is short

Method used

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  • Flake-type oxygen sensor and preparation method thereof
  • Flake-type oxygen sensor and preparation method thereof
  • Flake-type oxygen sensor and preparation method thereof

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preparation example Construction

[0066] Please also refer to image 3 , the preparation method of the above-mentioned chip oxygen sensor 100 according to an embodiment, comprising the following steps:

[0067] S10, providing the signal layer 10 and the air channel support layer 20 laminated on the signal layer 10, the signal layer 10 includes an oxygen-sensitive substrate 110 and electrodes arranged on both sides of the oxygen-sensitive substrate 110, and the air channel support layer 20 is provided with a reference Air channel 210 .

[0068] The preparation method of the signal layer 10 is as follows:

[0069] S12. 5YSZ or 8YSZ with a mass ratio of 50-70:20-30:5-11:1-6:2-6:2-7, the first organic solvent, the first binder, and the first plasticizer , The first dispersant and the first defoamer are mixed evenly, and after ball milling for 12 to 36 hours, the cast slurry is obtained, and then, the cast slurry is formed into a film by tape casting, and the oxygen-sensitive matrix is ​​formed after the film is ...

Embodiment 1

[0101] (1) Preparation of oxygen sensitive substrate, air channel support layer and heating substrate.

[0102] Mix 5YSZ, tetrahydrofuran, PVB, DOP, polyacrylic acid solution with a mass ratio of 50:30:5:6:5:5, and Dongfu Chemical’s model SRE-2031 foam breaker, and ball mill for 24 hours to obtain The casting slurry is then formed into a film by using a tape casting method, and the film is dried and solidified to form a green body. A green body with a thickness of 0.2 mm is prepared as an oxygen-sensitive matrix for future use. A green body with a thickness of 250 μm is prepared, and then laser cutting is used to cut and form air channels on the green body, and the green body formed with air channels is used as an air channel support layer for later use. A green body with a thickness of 350 μm was prepared and used as a heating substrate for later use.

[0103] (2) Prepare the signal layer.

[0104] The first electrode paste is screen-printed on one side of the oxygen-sensi...

Embodiment 2

[0127] (1) Preparation of oxygen sensitive substrate, air channel support layer and heating substrate.

[0128] Mix 5YSZ, hexane, PVB, DBP, polyacrylic acid solution and EFKA-2040 foam breaker with a mass ratio of 70:25:7:1:2:7 evenly, and after ball milling for 12 hours, The casting slurry is obtained, and then, the casting slurry is formed into a film by a tape casting method, and the film is dried and solidified to form a green body. A green body with a thickness of 0.4 mm is prepared as an oxygen-sensitive substrate for future use. A green body with a thickness of 400 μm is prepared, and then laser cutting is used to cut and form air channels on the green body, and the green body formed with air channels is used as an air channel support layer for later use. A green body with a thickness of 400 μm was prepared and used as a heating substrate for later use.

[0129] (2) Prepare the signal layer.

[0130] The preparation method of the signal layer is basically the same as...

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Abstract

The invention discloses a flake-type oxygen sensor. The flake-type oxygen sensor comprises a signal layer, an air duct supporting layer and a heating layer, and the above layers are orderly stacked. A first transition layer is arranged between a first insulating layer and the air duct supporting layer, the first transition layer is prepared from a mixture of materials of the air duct supporting layer and the first insulating layer, a second transition layer is arranged between a second insulating layer and a heating substrate, and the second transition layer is prepared from a mixture of the materials of the second insulating layer and the heating substrate so that properties of the materials of the first transition layer, the second transition layer and the air duct supporting layer are similar, and properties of the materials of the second transition layer, the second insulating layer and the heating substrate are similar and thus when temperatures of all layers of the flake-type oxygen sensor are changed, because of similar expansion coefficients of all the layers, in sintering and high / low temperature work, cracks are not produced easily and a service life of the flake-type oxygen sensor is improved. The invention also provides a preparation method of the flake-type oxygen sensor.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a chip oxygen sensor and a preparation method thereof. Background technique [0002] In recent years, automobile exhaust emissions have had a considerable impact on the environment. Now new cars leaving the factory will be equipped with an automobile oxygen sensor before and after the three-way catalyst, and some cars even have more. At present, most of the oxygen sensors used in various models at home and abroad are chip-type zirconia oxygen sensors. Because the chip oxygen sensor has a series of advantages that the tubular oxygen sensor does not have: such as simple structure, easy molding, fast response, small size, etc., the development of the chip oxygen sensor meets the needs of the market. The tubular oxygen sensors currently on the market have been gradually replaced by chip oxygen sensors. [0003] When the traditional chip oxygen sensor is sintered, due to the inconsi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/409
Inventor 周超付振晓苏红娟梁金葵
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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