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Preparation method of ag‑ni based contact material

A contact material, ag-ni technology, applied in the direction of electrical components, electric switches, circuits, etc., can solve the problems of easy agglomeration of nickel salt, large nickel particle size, unfavorable nickel dispersion, etc., and achieve good conductivity and Ni distribution Uniform, productivity-friendly effect

Active Publication Date: 2017-05-17
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method of Japanese Patent Publication No. 2009-30100 uses nickel salt instead of nickel powder to mix with silver powder, and has undergone a process of mixing-drying-reduction-ball milling-sintering, and the operation is complicated, and the drying process Medium nickel salts are prone to agglomeration, which is not conducive to the dispersion of nickel in the later stage. During the reduction process of nickel powder, a high-temperature calcination process (calcination temperature is 750°C) is adopted, and the size of nickel particles is relatively large. In order to reduce the size of nickel particles and disperse nickel Uniform, need long time ball milling (ball milling time is 24 hours)

Method used

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  • Preparation method of ag‑ni based contact material
  • Preparation method of ag‑ni based contact material
  • Preparation method of ag‑ni based contact material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] This embodiment is used to illustrate the Ag-Ni based contact material and its preparation method. Wherein, the method for preparing Ag-Ni base contact material comprises the following steps:

[0043] (1) Immerse 100g of Ag powder with an average particle size of 300μm into 100ml of electrolyte, stir, and place it for 5-7 minutes to obtain Ag powder impregnated with electrolyte; the electrolyte formula is: 260g / L nickel sulfate, 35g / L nickel chloride solution and 40g / L boric acid.

[0044] (2) Connect the circular cathode disk 11 and the circular anode disk 8 in the electroplating device to the power supply respectively, put the Ag powder impregnated with the electrolyte into the lower hopper 1, and through the vibration of the vibrator 3, continuously and quantitatively Enter the small hopper 7, and feed it to the disk surface of the circular cathode disk 11 through the central channel of the circular anode disk. The circular cathode disk 11 generates relative rotatio...

Embodiment 2

[0050] This embodiment is used to illustrate the Ag-Ni based contact material and its preparation method. Wherein, the method for preparing Ag-Ni base contact material comprises the following steps:

[0051] (1) Immerse 100g of Ag powder with an average particle size of 200μm into 120ml of electrolyte, stir, and place it for 8-10min to obtain Ag powder impregnated with electrolyte; the formula of electrolyte is: 280g / L nickel sulfate , 35g / L nickel chloride solution and 45g / L boric acid.

[0052] (2) Connect the circular cathode disk 11 and the circular anode disk 8 in the electroplating device to the power supply respectively, put the Ag powder impregnated with the electrolyte into the lower hopper 1, and through the vibration of the vibrator 3, continuously and quantitatively Enter the small hopper 7, and feed it to the disk surface of the circular cathode disk 11 through the central channel of the circular anode disk. The circular cathode disk 11 generates relative rotatio...

Embodiment 3

[0058] This embodiment is used to illustrate the Ag-Ni based contact material and its preparation method. Wherein, the method for preparing Ag-Ni base contact material comprises the following steps:

[0059] (1) Immerse 100g of Ag powder with an average particle size of 100μm into 150ml of electrolyte, stir, and place it for 8-10 minutes to obtain Ag powder impregnated with electrolyte; the electrolyte formula is: 300g / L nickel sulfate, 45g / L nickel chloride solution and 50g / L boric acid.

[0060] (2) Connect the circular cathode disk 11 and the circular anode disk 8 in the electroplating device to the power supply respectively, put the Ag powder impregnated with the electrolyte into the lower hopper 1, and through the vibration of the vibrator 3, continuously and quantitatively Enter the small hopper 7, and feed it to the disk surface of the circular cathode disk 11 through the central channel of the circular anode disk. The circular cathode disk 11 generates relative rotati...

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Abstract

The invention provides a method for preparing Ag-Ni yl contact materials, comprising the steps of: performing Ni plating treatment on Ag powder with grain sizes of 100-300 [mu]m through electroplating to obtain composite powder; and ball-milling and hot-pressing the obtained composite powder to obtain Ag-Ni yl contact materials, wherein the Ag-Ni yl contact materials comprise 80-95 weight% of Ag of the weight of contact materials and 5-20 weight % of Ni of the weight of the contact materials. The method is simple to operate, has strong controllability, and is beneficial to for industrialized production.

Description

technical field [0001] The invention relates to a preparation method of a contact material, in particular to a preparation method of an Ag-Ni base contact material. Background technique [0002] Silver-based electrical contacts are the core components of electrical products such as electrical switches and relays, and are one of the important components that limit the life and performance of electrical products. In recent years, with the remarkable progress of electronics and electrotechnical technology, the scope of use of silver-based electrical contacts covers from the weak current field of telecommunications and various electronic instruments to the strong electric field such as electrical appliances that cut off large currents. The functional requirements of the headers also vary widely. [0003] Traditional silver-based contact materials include Ag-CdO-based contact materials, for example, an alloy composed of 10% by weight of CdO and the balance of Ag (abbreviation, A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H11/04
Inventor 陈国锋李长鹏
Owner SIEMENS AG