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Supporting positioning device for lead frame stacking

A support positioning and lead frame technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of IPM increasing production costs, achieve the effects of reducing production costs, ensuring accuracy, and saving design and processing expenses

Active Publication Date: 2015-09-02
XIAN YONGDIAN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) When purchasing lead frames in batches, corresponding tooling costs will be added, which will undoubtedly increase the production cost for IPM production

Method used

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  • Supporting positioning device for lead frame stacking
  • Supporting positioning device for lead frame stacking
  • Supporting positioning device for lead frame stacking

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Please also see Figure 4 to Figure 6 , Figure 4 It is a structural schematic diagram of the lead frame disclosed in the present invention. Figure 5 It is a sectional view of the lead frame disclosed in the present invention. Figure 6 It is a state diagram of lead frame stacking in the present invention. As shown in the figure, there is a support and positioning device for stacking lead frames. The support and positioning device is arranged under the lead frame 1. The lead frame 1 includes a body 2 and a bending part 3 bent and arranged under the body 2. The bending part The IGBT chip 4 and the diode chip 5 are fixedly arranged on the 3; the supporting positioning device is a supporting part 6 arranged on the lower surface of the body 2, and the height of the supporting part 6 is greater than that of the bending part 3. By arranging the supporting part higher than the bending part, when a plurality of lead frames are stacked, the supporting part can isolate the ad...

Embodiment 2

[0040] The rest is the same as the embodiment 1, except that the support member 6 can also be integrally formed on the lower surface of the lead frame 1 . It can be processed and formed together when forming the lead frame, without post-cutting and bending treatment, simplifying the process steps and reducing the manufacturing cost.

[0041] The invention discloses a support and positioning device for stacking lead frames. The support and positioning device is a support part arranged under the lead frame. The height of the support part is greater than the height of the bending part on the lead frame, and the lead frames can be stacked together directly. For transportation, the tooling used for carrying the lead frame is eliminated, the cost of carrying the tooling design and processing is saved, and the production cost is effectively reduced, and the upper and lower lead frames can be effectively separated by setting the supporting parts to avoid stacking of the lead frames Th...

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PUM

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Abstract

The invention discloses a supporting positioning device for lead frame stacking. The supporting positioning device comprises support parts arranged under lead frames. The heights of the support parts are greater than those of bending parts on the lead frames. The lead frames can be directly stacked together for transportation. A tool for bearing lead frames is not required. The cost for designing and processing the bearing tool is saved. The production cost is effectively lowered. By arranging the support parts, the device can make the vertically arranged lead frames effectively separated. The key bending parts on the lead frames are prevented from being affected during a lead frame stacking conveying process. The lead frame precision is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of plastic-encapsulated IPM lead frames, and in particular relates to a support and positioning device for stacking lead frames. Background technique [0002] Plastic-encapsulated IPM (Intelligent Power Module, Intelligent Power Module) is a new type of control module that integrates the IGBT chip and its drive circuit, control circuit and overcurrent, undervoltage, short circuit, overheating and other protection circuits. It is a complex and advanced power module that can automatically realize complex protection functions such as overcurrent, undervoltage, short circuit and overheating, so it has intelligent features. At the same time, it has the advantages of low cost, miniaturization, high reliability and easy use. Widely used in frequency conversion household appliances, inverter power supply, industrial control and other fields, the social and economic benefits are very considerable. [0003] For the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68
Inventor 吴磊
Owner XIAN YONGDIAN ELECTRIC