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Shielding films with high thermal conductivity

A technology with high thermal conductivity and coefficient, applied in layered products, metal layered products, synthetic resin layered products, etc., can solve problems such as human health hazards, electromagnetic interference, abnormal work, etc., to improve utilization and improve stability , The effect of improving the service life of the product

Active Publication Date: 2017-06-30
斯迪克新型材料(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The electromagnetic waves released by electronic products will bring electromagnetic interference to other electronic devices around them, making them work abnormally; at the same time, they will also cause harm to human health

Method used

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  • Shielding films with high thermal conductivity

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Embodiment 1

[0035] Embodiment 1: A shielding film with high thermal conductivity, including a PET insulating layer 1, a metal layer 2, a wave-absorbing layer 3 and a release material layer 4; a first adhesive layer is provided between the PET insulating layer 1 and the metal layer 2 layer 5, a second adhesive layer 6 is arranged between the metal layer 2 and the wave-absorbing layer 3, and a third adhesive layer 7 is arranged between the wave-absorbing layer 3 and the release material layer 4.

[0036] The components and contents of the absorbing layer 3 are as shown in Table 1:

[0037] Table 1

[0038] Example 1 Example 2 Example 3 Example 4 100 parts of absorbing powder 100 copies 100 copies 100 copies 100 copies 25~35 parts of butyl acrylate 25 copies 32 copies 30 copies 28 copies 12~15 parts of acrylic acid 12 copies 15 copies 14 copies 11 copies 20~35 parts of isooctyl acrylate 25 copies 22 copies 32 copies 35 cop...

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Abstract

The invention discloses a shielding film with a high heat-conducting coefficient. The shielding film comprises a PET insulating layer, a metal layer, a wave absorbing layer and a release material layer, wherein a first adhesive layer is arranged between the PET insulating layer and the metal layer, and a second adhesive layer is arranged between the metal layer and the wave absorbing layer; the wave absorbing layer comprises the following components in parts by weight: 100 parts of wave absorbing powder, 25-35 parts of butyl acrylate, 12-15 parts of acrylic acid, 20-35 parts of 2-ethylhexyl acrylate, 10-30 parts of methyl methacrylate, 1-3 parts of vinyl acetate, 0.1-1 part of methacrylic acid-2-hydroxy ethyl acrylate, 0.5-2 parts of sodium polyacrylate and 0.4-1 part of methyl ethyl ketone peroxide; the wave absorbing powder comprises the following components in parts by weight: 100 parts of barium ferrite powder, 18-25 parts of nickel sesquioxide, 8-12 parts of nano graphite powder, 8-12 parts of cobalt chloride, 60-70 parts of unsaturated polyester and 40-50 parts of sodium dodecyl benzene sulfonate. The shielding film disclosed by the invention has the advantages that the over concentration of heat is avoided, the benefit for heat dissipation is achieved, the upwarping of the film due to temperature rise is also avoided and the stability of the performance of a product is improved.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a shielding film with high thermal conductivity. Background technique [0002] The development of the electronics and communication industry is advancing by leaps and bounds, and more and more electronic and electrical products have entered the lives of ordinary people. While these products improve people's quality of life, they also bring about a prominent problem, that is, the problem of electromagnetic radiation. The electromagnetic waves released by electronic products will bring electromagnetic interference to other electronic devices around them, making them work abnormally; at the same time, they will also cause harm to human health. [0003] At present, miniaturization and high integration are the mainstream trends in the development of electronic products, and the internal space of these products is relatively small. Among the wave-absorbing ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/09B32B15/08B32B27/18B32B9/04
CPCB32B9/04B32B15/08B32B15/09B32B27/18B32B2307/20
Inventor 金闯梁豪
Owner 斯迪克新型材料(江苏)有限公司
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