Chip bonding film with cutting disk, semiconductor device, and manufacturing method for semiconductor device

A chip bonding and dicing chip technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, film/sheet-like adhesives, etc., can solve the problems of semiconductor wafer holding force reduction, fluidity reduction, peeling reduction, etc., Achieve the effect of suppressing cracks, preventing peeling, and not easy to break

Active Publication Date: 2015-09-30
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, this will lead to a decrease in fluidity, a decrease in the holdin

Method used

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  • Chip bonding film with cutting disk, semiconductor device, and manufacturing method for semiconductor device
  • Chip bonding film with cutting disk, semiconductor device, and manufacturing method for semiconductor device
  • Chip bonding film with cutting disk, semiconductor device, and manufacturing method for semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0153] (Example 1)

[0154] The following (a) to (b) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23% by weight.

[0155] (a) Acrylate copolymer with ethyl acrylate, butyl acrylate and acrylonitrile as main monomers (manufactured by Nagase Kasei Co., Ltd., trade name: SG-708-6, content of each main monomer: acrylic acid 51 wt% ethyl ester, 26 wt% butyl acrylate, 19 wt% acrylonitrile)

[0156] 97 copies

[0157] (b) Filler (manufactured by Admatechs, product name: SO-E1, average particle size: 0.25 μm)

[0158] 100 servings

[0159] This adhesive composition solution was applied to a release treated film (release liner) formed of a 38 μm thick polyethylene terephthalate film after silicone release treatment, and dried at 130°C 2 minute. Thus, a die-bonding film A having a thickness of 20 μm was produced.

Example Embodiment

[0160] (Example 2)

[0161] The following (a) to (b) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23% by weight.

[0162] (a) Acrylate copolymer with ethyl acrylate, butyl acrylate and acrylonitrile as main monomers (manufactured by Nagase Kasei Co., Ltd., trade name: SG-708-6, content of each main monomer: acrylic acid 51 wt% ethyl ester, 26 wt% butyl acrylate, 19 wt% acrylonitrile)

[0163] 83 copies

[0164] (b) Thermal crosslinking agent (liquid epoxy resin (softening point: below 0°C), manufactured by Mitsubishi Chemical Corporation, product name: JER828)

[0165] 12 servings

[0166] This adhesive composition solution was applied to a release treated film (release liner) formed of a 38 μm thick polyethylene terephthalate film after silicone release treatment, and dried at 130°C 2 minute. Thus, a die-bonding film B having a thickness of 20 μm was produced.

Example Embodiment

[0167] (Example 3)

[0168] The following (a) to (b) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23% by weight.

[0169] (a) Acrylate copolymer with ethyl acrylate, butyl acrylate and acrylonitrile as main monomers (manufactured by Nagase Kasei Co., Ltd., trade name: SG-P3, content of each main monomer: ethyl acrylate 30% by weight, 39% by weight of butyl acrylate, 28% by weight of acrylonitrile)

[0170] 90 servings

[0171] (b) Thermal crosslinking agent (liquid phenol resin (softening point: below 0°C), manufactured by Meiwa Chemical Co., Ltd., product name: MEH-8000H)

[0172] 5 servings

[0173] This adhesive composition solution was applied to a release treated film (release liner) formed of a 38 μm thick polyethylene terephthalate film after silicone release treatment, and dried at 130°C 2 minute. Thus, a die-bonding film C having a thickness of 20 μm was produced.

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Abstract

Provided are a chip bonding film with a cutting disk, a semiconductor device, and a manufacturing method for the semiconductor device. The invention provides a chip bonding film with a cutting disk, the chip bonding film can restrain cracks and scars from generating in conveying at low temperature, and can restrain the cutting disk from separating the chip bonding film. In the chip bonding film with a cutting disk, a chip bonding film is arranged on the cutting disk. The chip bonding film is characterized in that lost elasticity modulus of the chip bonding film at the temperature of lower than 0 DEG C is more than 20 MPa and lower than 500 MPa.

Description

Technical field [0001] The present invention relates to a method for manufacturing a die bonding film with a dicing sheet, a semiconductor device, and a semiconductor device. Background technique [0002] Conventionally, a die-bonding film with a dicing sheet in which a die-bonding film is provided on a dicing sheet has been used in the manufacturing process of a semiconductor device (for example, refer to Patent Document 1). [0003] When the die-bonding film is placed in a high-temperature, high-humidity environment and stored for a long period of time under a load, it may be cured. In addition, this may result in a decrease in fluidity, a decrease in holding power to a semiconductor wafer, and a decrease in peelability after dicing. Therefore, the die-bonding film with a dicing sheet is often transported while being frozen at -30 to -10°C or refrigerated at -5 to 10°C, thereby achieving long-term storage of film characteristics. [0004] Prior art literature [0005] Patent liter...

Claims

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Application Information

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IPC IPC(8): C09J7/02C09J133/08C09J163/00C09J161/06H01L21/683
CPCH01L2224/32225H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/181H01L2924/00012H01L2924/00014H01L2924/00H01L21/6836H01L24/29H01L24/83H01L2221/68327H01L2224/2919
Inventor 大西谦司三隅贞仁村田修平宍户雄一郎木村雄大
Owner NITTO DENKO CORP
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