Electric conduction connecting structure and manufacturing method thereof
A technology of conductive connection structure and manufacturing method, which is applied in the direction of cable/conductor manufacturing, conductive layer on insulating carrier, circuit, etc., can solve the problems of high proportion, high end product price, and non-compliance with market demand, etc., to achieve The effect of reducing production costs
Inactive Publication Date: 2015-09-30
SHENZHEN LAIBAO HI TECH
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Problems solved by technology
However, whether it is silver paste or molybdenum-aluminum-molybdenum materials, its cost accounts for a relatively high proportion of the entire terminal products such as smartphones, tablet computers, and notebook computers. Therefore, the price of terminal products is virtually raised, which does not meet market demand. On the other hand, in order to meet the resistance and reliability requirements, the metal leads formed by traditional molybdenum-aluminum-molybdenum materials have a thicker overall thickness of more than 3000 angstroms. Therefore, the working hours of the production process are also extended, and the operating cost increases
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[0023] In order to illustrate the conductive connection structure provided by the present invention and the manufacturing method thereof, a detailed description will be given below in conjunction with the drawings and text descriptions of the specification.
[0024] Please refer to figure 1 , which is a schematic diagram of a connection structure of a conductive connection structure 123 according to a preferred embodiment of the present invention, and the conductive connection structure 123 is used to connect a touch electrode layer 112 to a processor 111 to transmit signals. The conductive connection structure 123 includes a first functional layer 123a, a second functional layer 123b and a third functional layer 123c. In other implementation manners, the conductive connection structure may also be connected to a display device and the like.
[0025] The first functional layer 123a is formed on a substrate or the first surface 101a of the substrate 101. In this embodiment, th...
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Abstract
The invention relates to the technical field of panel displaying, in particularly relates to an electric conduction connecting structure. The electric conduction connecting structure at least comprises a first functional layer and a second functional layer. The first functional layer is formed on a base plate or a substrate. The second functional layer is formed on the first functional layer. The first functional layer is at least composed of materials with good combining performance. The second functional layer is at least composed of materials with good conductivity. The thickness of the second functional layer is at least larger than that of the first functional layer.
Description
technical field [0001] The invention relates to the field of flat panel display technology, in particular to a conductive connection structure and a manufacturing method thereof. Background technique [0002] The touch panel can be divided into a visible area and a non-visible area. The visible area includes at least a touch electrode layer, which is used to realize the touch function; the non-visible part includes a shielding layer and a conductive lead layer, wherein the conductive The leads serve as connection wires between the touch electrodes in the touch electrode layer and the touch chip, and are used to transmit touch signals to realize user touch operations. [0003] The current conductive leads are generally made of metal materials, most commonly formed by silk screen printing silver paste to reduce channel impedance. For another example, the patent No. 201310298159.1, titled "Method for Manufacturing Touch Screen Frame", discloses a method for making metal leads ...
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IPC IPC(8): G06F3/041H01B5/14H01B1/02H01B13/00
Inventor 王士敏何云富郭志勇李绍宗陈雄达
Owner SHENZHEN LAIBAO HI TECH