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Power module and manufacturing method thereof

一种电源模块、制造方法的技术，应用在印刷电路制造、电感/变压器/磁铁制造、电路等方向，能够解决电源供应模块体积大、散热性不够好、工艺复杂等问题

Active Publication Date: 2017-12-12
SUMIDA ELECTRIC H K COMPANY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional manufacturing method of integrated power supply modules is generally to assemble independent electronic components (such as IC, R, C), coils, etc. on PCB or other substrates through a certain loop connection method, and then encapsulate them with plastic packaging materials. This process is prone to cracks, and has poor heat dissipation and high cost
In order to overcome the above problems, there is a technology that pre-processes the magnetic body with an installation space, and then covers the magnetic body on the PCB. The installation space reserved on the magnetic body is used to accommodate electronic components, coils and other parts, but this The process of this method is complex, and the processed power supply module is large in size and not good enough in heat dissipation; there is also a method of encapsulation through a mixture of magnetic materials. This method is usually used to manufacture inductors, and the packaging is pressed by cold pressing. Requires a lot of pressure, resulting in higher cost and easy damage to internal components

Method used

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  • Power module and manufacturing method thereof
  • Power module and manufacturing method thereof
  • Power module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] Reference Figure 1 to Figure 7 , A method of manufacturing a power module, including the following steps:

[0078] The connecting body 100 is arranged so that the connecting body 100 has a preset circuit connection mode, and the connecting body 100 is provided with a terminal 110 that can be electrically connected to the outside;

[0079] The electronic components including at least the integrated circuit chip 300 are arranged in the preset circuit connection mode of the connecting body 100 in an electrically connected manner, and the coil 200 is arranged, and the connecting end of the coil 200 is electrically connected Is configured in the preset circuit connection mode of the connecting body 100;

[0080] Prefabricate the mold cavity 101, and place the aforementioned connecting body 100 configured with the coil 200 and electronic components in the mold cavity 101;

[0081] The magnetic mixture 800 is configured, and the magnetic mixture 800 is filled into the cavity 101 wher...

Embodiment 2

[0095] The manufacturing method of the power module described in this embodiment is different from the first embodiment in that the magnetic mixture 800 contains 92 parts by weight of carboxyl iron powder, 8 parts by weight of epoxy resin, and the intermittently applied pressure is 0.2 Kg / cm², the number of pressurization is 200 times, and the intermittent frequency is 250 times / min; meanwhile, the pressure of heating and pressurization is 15kg / cm², the temperature is 160℃, and the time is 5 minutes; the heating temperature It gradually rises from normal temperature to 150 degrees Celsius, and the heating rate is 1 degrees Celsius per minute, in which the temperature is kept at 75 degrees Celsius, 100 degrees Celsius, and 150 degrees Celsius for 1 hour.

[0096] In the method described in this embodiment, carboxyl iron powder (CIP) with insulation and anti-rust function and epoxy resin containing hardener are configured, and the stirring temperature is controlled below 40 degrees ...

Embodiment 3

[0098] The manufacturing method of the power module in this embodiment is different from the first embodiment in that the magnetic mixture 800 is a clay-like mixture containing 90-95 parts by weight of magnetic powder and 5-10 parts by weight of resin. The magnetic powder is ferrite sintered powder and calcined powder, or alloy powder, or amorphous powder and microcrystalline powder, or any one of iron powder or a mixture between them. The resin is a thermosetting resin, such as any one of epoxy resin, silicone resin, phenolic resin or any two or more mixed resins between them. In this embodiment, the pressure is not intermittent but continuous The magnetic body is formed by pressing, and the applied pressure is in the range of 1-50 kg / cm². The magnetic body is not heated and pressurized at the same time, but the mold cavity and the magnetic body are processed before the magnetic body is released from the mold cavity. Pre-heating, the temperature range of the pre-heating is 120...

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Abstract

The invention discloses a power supply module and a manufacturing method thereof. The manufacturing method of the power supply module includes the following steps: arranging a coil, and arranging the connection end of the coil in the preset circuit connection mode of the connecting body in an electrically connected manner In; prefabricating the mold cavity, and placing the connecting body configured with coils and electronic components into the mold cavity; configuring a magnetic mixture, and filling the magnetic mixture into the mold cavity in which the aforementioned connecting body is placed, and then pressurizing Forming a magnetic body, the magnetic body at least wraps the aforementioned coil and electronic components and the part of the connecting body used to configure the aforementioned coil and electronic components, and the terminal is exposed on the outside of the magnetic body; the aforementioned magnetic body is removed from the mold The mold is released from the cavity; the temperature of the demoulded magnetic body is heated. The power module and the manufacturing method thereof have low molding pressure, and the manufactured power module has good heat dissipation effect.

Description

Technical field [0001] The invention relates to a power module and a manufacturing method thereof. Background technique [0002] In the field of electronic products, in order to accurately provide the voltage and current required for the actual work of electronic equipment, electronic components such as inductors, resistors, capacitors, and integrated circuit chips are usually formed into a power supply module (Power Supply in Package) to achieve The function of voltage or current conversion. The traditional manufacturing method of integrated power supply module is generally to assemble independent electronic components (such as IC, R, C), coils, etc., to PCB or other substrates through a certain loop connection method, and then use plastic packaging materials to encapsulate them. As a result, this process is prone to cracks, poor heat dissipation, and high cost. In order to overcome the above-mentioned problems, there is a technique that pre-processes the magnetic body with in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M1/00H05K3/00H05K9/00
CPCH01F41/02H02M1/00H01F27/022H05K2201/086H05K2203/0195H05K2203/0278H05K2203/1105H01F41/005Y10T29/49146H05K3/284
Inventor 张宏年刘雁飞道格拉斯·詹姆士·马尔科姆
Owner SUMIDA ELECTRIC H K COMPANY