Tempered ceramic glass package

Abstract

The invention relates to a tempered ceramic glass package which is formed by heating and pressure casting. At least two dam parts for correspondingly anchoring at least one element and at last one cone terminal in an array cone pattern are connected with a terminal which corresponds to a base surface of at least one element; the at least two dam parts extend on a thick base surface of a ceramic base; the cone terminal in the array cone pattern extends between the at least two corresponding dam parts; at least two external connection terminals are horizontally and evenly arranged on the edge of the side surface of the same base surface and are connected to the at least one cone terminal in the array cone pattern; connection and arrangement of the terminals have electrical connectivity; a recess for accommodating the ceramic base is formed in a ceramic cover; the back surface of the base surface of at least one element corresponding to the at least one cone in the array cone pattern corresponds to the at least one cone terminal in the array cone pattern; the back surface of the base surface extends on the base surface of an inner base of the recess; and the at least one cone terminal in the array cone pattern extends on the thick base surface of the ceramic base. The tempered ceramic glass package has the advantages of relatively good electric characteristic, relatively high heat conductivity, relatively low thermal expansion coefficient and relatively high anti-deformation mechanical strength.

Description

technical field [0001] The invention relates to a toughened ceramic glass package formed by heating and pressure casting. The toughened ceramic glass material has better electrical properties, higher thermal conductivity, lower thermal expansion coefficient and higher mechanical strength against deformation. Background technique [0002] Since the development direction of semiconductor technology is to continuously improve the safety, reliability and lifespan, the components of the existing resin polymer packaging technology and the resin polymer are in contact with the resin polymer for a long time at high temperature, which leads to leakage or short circuit inside the package where the resin polymer is partially carbonized, and Resin polymers are easily dissolved, which affects the safety, reliability and life of integrated circuits or semiconductor products. Therefore, high-performance ceramic packages have become an essential element in integrated circuit design, and then...

AI Technical Summary

Problems solved by technology

[0002] Since the development direction of semiconductor technology is to continuously improve the safety, reliability and lifespan, the components of the existing resin polymer packaging technology and the resin polymer are in contact with the resin polymer for a long time at high temperature, which leads to leakage or short circuit inside the package where the resin polymer is partially carbonized, and Resin polymers are easily dissolved, which affects the safety, reliability and life of integrated circuits or semiconductor products. Therefore, high-performance ceramic packages have become an essential element in integrated circuit design, and then they are co-sintered at high or low temperatures. The prepared ceramic carrier medium has good electrical properties, high temperature resistance and deformation resistance. Since the traditional ceramic packaging shell is made of high-temperature co-fired ceramic materials and sintered at a temperature of 1400°C to 1600°C, the overall production time is as long as 20-24 hours, the low-temperature co-fired ceramic material is sintered at a temperature of 850°C-870°C, and the overall production time is as long as 6-8 hours. The production cost has always been high, the manufacturing cost is expensive, and the technical requirements for production are high. The output is limited by technology and equipment, and the production efficiency and product yield are reduced, which is far from satisfying the growing market demand. It can be seen that the above-mentioned existing co-fired ceramic packaging structures for packaging electronic components and their In terms of structure and use of co-fired ceramic materials, it is obvious that in order to solve the above-mentioned problems, it is necessary to seek a more simple and feasible design and a lower price packaging shell to supplement and replace the existing ceramic packaging products. The present invention The purpose of the invention is to overcome the defects of the existing packaging structure and materials for packaging electronic components, and provide a new type of packaging structure and materials for packaging electronic components. The technical problem to be solved is to make it Toughened ceramic glass material is formed by heating and pressure casting. Toughened ceramic glass material has good electrical properties, high thermal conductivity, low thermal expansion coefficient and high mechanical strength against deformation

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