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Thermal Mitigation in Double Booked Dual Active Devices

A technology for active connection and thermal problems, which is applied in the direction of multi-programming devices, energy consumption reduction, program startup/switching, etc., and can solve problems such as high temperature processor or memory

Inactive Publication Date: 2020-05-19
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, while a modem on a die may be operable at temperatures around its higher temperature tolerance range, it may cause a processor or memory provided on the same die or in the same package to stall because this temperature is critical for processing too high for a device or memory

Method used

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  • Thermal Mitigation in Double Booked Dual Active Devices
  • Thermal Mitigation in Double Booked Dual Active Devices
  • Thermal Mitigation in Double Booked Dual Active Devices

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Embodiment Construction

[0023] In the following description, specific details are given in order to provide a thorough understanding of various aspects of the invention. However, it will be understood by those skilled in the art that the described aspects may be practiced without these specific details. For example, circuits may be shown in block diagrams in order to avoid obscuring aspects in unnecessary detail. In other instances, well-known circuits, structures and techniques may not have been shown in detail in order not to obscure aspects of the invention.

[0024] A system, method and apparatus are described. The apparatus may include a modem of a wireless telephony device adapted or configured to resolve the thermal issue based on the identification of the source of the thermal problem, the subscription of the wireless device, and / or the operational status of two or more connections maintained by the wireless device. Thermal mitigation is selectively invoked in response to the thermal mitiga...

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Abstract

A system, a method and an apparatus are described. The apparatus includes a modem that responds to a thermal mitigation request by invoking different levels of thermal mitigation for different concurrently active connections. In some instances, the modem may invoke thermal mitigation with respect to a first active connection and refrain from invoking thermal mitigation with respect to a second active connection maintained by the modem. The apparatus determines the first and second active connections based on subscriptions corresponding to subscriber identification modules, an identification of a power amplifier or group of power amplifiers responsible for a thermal issue in the modem. The selection of mitigation levels for each active connection and decisions to invoke mitigation on one connection while refraining from invoking mitigation on another connection may be based on priorities of the active connections, including quality of service related priorities.

Description

[0001] Claim of priority under 35 U.S.C. §119 [0002] This patent application asserts U.S. Provisional Application No. 61 / 753,419, filed January 16, 2013, entitled "Thermal Mitigation In Dual SIM Dual Active Devices," and filed on June 16, 2013. Priority benefit of U.S. Utility Model Application No. 13 / 919,415, filed on March 17, entitled "Thermal Mitigation in Dual Subscription Dual Active Devices," both of which are assigned To the present assignee and both applications are expressly incorporated herein by reference. technical field [0003] Various features relate to thermal management of integrated semiconductor devices, systems and / or packages. Background technique [0004] Wireless devices typically include integrated semiconductor devices, which may also be referred to as integrated circuits (ICs), which may include one or more processors, memory, and modems for wireless communication. The IC may be provided on die in a package including one or more die provided o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20G06F9/48H04W52/02
CPCY02D30/70
Inventor 弗朗西斯·恩益阿米·德比希尔罗纳德·埃尔顿阿米特·马哈詹麦可·麦可克劳礼萨·沙希迪斯里达尔·班达鲁阿希什·高内卡
Owner QUALCOMM INC