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Solder Printer

A printing press and solder technology, applied in printing presses, rotary printing presses, screen printing presses, etc., can solve problems such as inability to identify, printing pressure deviation from the target value, poor printing, etc.

Active Publication Date: 2020-01-03
FUJI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, no matter how the printing pressure is feedback-controlled, it is unavoidable that the actual printing pressure deviates from the target value due to changes in the reaction force caused by, for example, cream solder.
At this time, the actual printing pressure may deviate greatly from the target value. In that case, the possibility of printing failure increases.
However, existing solder printing machines only perform feedback control on the printing pressure, and even if the actual printing pressure greatly deviates from the target value, it cannot be recognized

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0033] A solder printer 10 (hereinafter, sometimes simply referred to as a printer) according to an embodiment will be described with reference to the drawings. The printer 10 is a device for printing cream solder 6 on a circuit board 4 which is an object to be printed. Usually, the printer 10 is used in an electronic component mounting line together with an electronic component mounting machine (not shown). In the electronic component mounting line, first, the printing machine 10 prints cream solder 6 on the circuit board 4, and second, the electronic component mounting machine mounts a plurality of electronic components on the circuit board 4 printed with the cream solder.

[0034] like figure 1 As shown, the printing machine 10 includes a mask 12, a squeegee unit 16, a squeegee moving device 20, a squeegee pressing device 30, a printing pressure sensor 34, a substrate conveying device 40, a substrate supporting device 42, a substrate clamping device 46, a processing devic...

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PUM

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Abstract

The invention provides a solder printing press, which comprises a photomask configured on a circuit board, a scraper for scraping paste solder into the photomask, a mobile device enabling the scraper to slide on the photomask, a pressing device for pressing the scraper sliding on the photomask onto the photomask, a sensor for determining pressure (i.e. printing pressure) of the pressing device and a processing device for judging whether a determined value of the sensor is in a normal range or not.

Description

technical field [0001] The technique disclosed here relates to a technique of printing solder, and particularly relates to a technique of printing creamy solder using a mask and a squeegee (so-called screen printing). Background technique [0002] A conventional solder printer is described in JP 2010-284874 A. This solder printer includes: a mask placed on a circuit board; a squeegee for brushing creamy solder onto the mask; a moving device for sliding the squeegee on the mask; and a squeegee for sliding on the mask. A pressing device that presses against the mask. [0003] The conventional solder printer described above further includes: a sensor for measuring the pressing force of the pressing device; and a processing device for controlling the pressing force of the pressing device based on the measured value of the sensor. The processing device increases the pressing force of the pressing device when the measured value of the sensor is smaller than the target value, and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41F15/08B41F33/00
Inventor 加藤光昭
Owner FUJI KK