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A kind of inorganic nano filler modified silicone pressure-sensitive adhesive and preparation method thereof

A technology of silicone pressure-sensitive adhesive and inorganic nano-filler, which is applied in the field of pressure-sensitive adhesives, can solve the problems of high production cost and poor heat resistance, and achieve the effects of improved bonding performance, improved peel strength, and environmental protection

Inactive Publication Date: 2017-07-18
DONGGUAN XINXING ORGANIC SILICON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The silicone pressure-sensitive adhesive has good initial viscosity, long-term performance, and is non-toxic, but its heat resistance is poor, and the catalyst uses platinum, so the production cost is high

Method used

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  • A kind of inorganic nano filler modified silicone pressure-sensitive adhesive and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] An inorganic nano-filler modified silicone pressure-sensitive adhesive, in parts by weight, includes the following components:

[0048] Vinyl polydimethylsiloxane 20 parts,

[0049] 20 parts of α,ω-alkoxy terminated polydimethylsiloxane,

[0050] 30 parts of hexamethylcyclotrisiloxane,

[0051] 20 parts of MQ silicone resin, 15 parts of anionic polyacrylamide,

[0052] 5 parts of polyborosiloxane, 2 parts of nano-boron carbide, 1 part of nano-silicon nitride,

[0053] 0.5 part of crosslinking agent, 1 part of dispersant.

[0054] Its preparation method comprises the following steps:

[0055] (1) prepare MQ silicone resin;

[0056] (2) MQ silicone resin prepared in step (1) and vinyl polydimethylsiloxane, α, ω-alkoxy terminated polydimethylsiloxane, hexamethylcyclotrisiloxane , polyborosiloxane, and anionic polyacrylamide were stirred and mixed evenly, transferred to an autoclave, and mixed for 1 hour at 80°C to obtain a mixed rubber;

[0057] (3) Continue to add ...

Embodiment 2

[0059] An inorganic nano-filler modified silicone pressure-sensitive adhesive, in parts by weight, includes the following components:

[0060] Vinyl polydimethylsiloxane 60 parts,

[0061] 50 parts of α,ω-alkoxy terminated polydimethylsiloxane,

[0062] 50 parts of hexamethylcyclotrisiloxane,

[0063] 30 parts of MQ silicone resin, 30 parts of anionic polyacrylamide,

[0064] 15 parts of polyborosiloxane, 5 parts of nano-boron carbide, 3 parts of nano-silicon nitride,

[0065] 1.5 parts of crosslinking agent, 2 parts of dispersant.

[0066] Its preparation method comprises the following steps:

[0067] (1) prepare MQ silicone resin;

[0068] (2) MQ silicone resin prepared in step (1) and vinyl polydimethylsiloxane, α, ω-alkoxy terminated polydimethylsiloxane, hexamethylcyclotrisiloxane , polyborosiloxane, and anionic polyacrylamide were stirred and mixed evenly, transferred to an autoclave, and mixed for 2 hours at 100°C to obtain a mixed rubber;

[0069] (3) Continue t...

Embodiment 3

[0071] An inorganic nano-filler modified silicone pressure-sensitive adhesive, in parts by weight, includes the following components:

[0072] Vinyl polydimethylsiloxane 30 parts,

[0073] 30 parts of α,ω-alkoxy terminated polydimethylsiloxane,

[0074] 35 parts of hexamethylcyclotrisiloxane,

[0075] 22 parts of MQ silicone resin, 18 parts of anionic polyacrylamide,

[0076] 7 parts of polyborosiloxane, 3 parts of nano-boron carbide, 1.5 parts of nano-silicon nitride,

[0077] 0.7 parts of crosslinking agent, 1.2 parts of dispersant.

[0078] Its preparation method comprises the following steps:

[0079] (1) prepare MQ silicone resin;

[0080] (2) MQ silicone resin prepared in step (1) and vinyl polydimethylsiloxane, α, ω-alkoxy terminated polydimethylsiloxane, hexamethylcyclotrisiloxane , polyborosiloxane, and anionic polyacrylamide were stirred and mixed evenly, transferred to an autoclave, and mixed for 1.2 hours at 85°C to obtain a mixed rubber;

[0081] (3) Continue...

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Abstract

The invention discloses an inorganic nano-filler modified silicone pressure-sensitive adhesive. The inorganic nano-filler modified silicone pressure-sensitive adhesive comprises, by weight, 20-60 parts of vinyl polydimethyl siloxane, 20-50 parts of a,w-alkoxy-terminated polydimethylsiloxane, 30-50 parts of hexamethyl cyclotrisiloxane, 20-30 parts of MQ organic silicon resin, 15-30 parts of anionic polyacrylamide, 5-15 parts of polyborosiloxane, 2-5 parts of nanometer boron carbide, 1-3 parts of nanometer silicon nitride, 0.5-1.5 parts of cross-linking agents and 1-2 parts of dispersing agents. The invention further discloses a preparation method of the silicone pressure-sensitive adhesive. The pressure-sensitive adhesive is high in adhesion capacity, good in chemical inertness, long in service life, excellent in wet resistance, electrical property and high-and-low temperature resisting property, odorless and poison-free, and the preparation method is simple, economical and environmentally friendly.

Description

[0001] Technical field: [0002] The invention relates to the technical field of pressure-sensitive adhesives, in particular to an inorganic nano-filler modified silicone pressure-sensitive adhesive. [0003] Background technique: [0004] In recent years, the demand for pressure-sensitive adhesives has maintained a rapid growth rate, and the development of high-performance special pressure-sensitive adhesives has been particularly rapid. The production and sales have continued to rise sharply, and it has become the highest-selling pressure-sensitive adhesive variety in the world. However, in my country, due to technical constraints, its application is far below the international level. With the continuous improvement of performance, it is expected that the growth of this type of pressure-sensitive adhesive will still be the fastest; while the traditional pressure-sensitive adhesive for packaging tape is due to The market is mature and saturated, with slow growth and low profits...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J183/06C09J183/04C09J183/08C09J133/26C09J11/04
Inventor 吴细飞
Owner DONGGUAN XINXING ORGANIC SILICON TECH