Antimony stannate nanowire composite electronic packaging material

Abstract

The invention discloses a stibium tannate nanowire composite electronic packaging material, and belongs to the structure material technology field. The provided packaging material comprises, by weight, 65-80% of stibium tannate nanowires, 3-5% of polyvinyl alcohol, 3-5% of polystyrene, 0.05-0.5% of acrylic acid-acrylic ester-sulfonate copolymers, 3-6% of aluminum isopropoxide, 7-14% of polyvinylidene fluoride and 3-5% of water. The diameter of the tibium tannate nanowire is 50 nm and the length of the tibium tannate nanowire is 20-30 micrometers. The provided packaging material has characteristics of excellent aging resistance, excellent corrosion resistance, easy processing, good insulation property, small thermal expansion coefficient, high heat conduction coefficient, low preparation temperature and the like, and has good application prospects in the electronic packaging field.

Description

technical field [0001] The invention belongs to the technical field of structural materials, and in particular relates to an antimony stannate nanowire composite electronic packaging material. Background technique [0002] Electronic packaging materials provide protection, support, assembly, insulation, heat dissipation and other functions for electronic equipment, and have important applications in electronic equipment and other fields. Inorganic non-metal, metal and polymer materials can be used as electronic packaging materials. The national invention patent "A Method for Preparing Monodisperse Crystalline Silica Spherical Particles by Carbon Coating" (National Invention Patent Application No.: 201110360535.6) discloses a method for preparing dispersed silica particles by carbon coating. A carbon layer with a uniform thickness is coated by an aerosol method or a hydrothermal method to obtain core-shell structure silica / carbon particles, and then oxidized to remove the co...

AI Technical Summary

Problems solved by technology

[0004] Although traditional inorganic non-metallic and metal packaging materials have the characteristics of high strength, small thermal expansion coefficient, and good aging resistance, they are difficult to process and the preparation temperature is high; polymer packaging materials have large thermal expansion coefficients and poor aging resistance

Therefore, a single traditional material is difficult to meet the performance requirements of electronic packaging materials

Images