Method for restraining hillocks formation on copper alloy thin film surface by applying prestressing force
A copper alloy, pre-stressed technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of reducing the service life of interconnecting wires and the service safety of micro-devices, achieving low cost, inhibiting easy formation Convex, simple effect
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Embodiment 1
[0019] A 180nm thick Cu-3.5Cr alloy film was prepared on a polyimide substrate (the substrate size is 100mm in length, 100mm in width, and 0.6mm in thickness) by magnetron sputtering. When the sample was taken out, it was found that the entire film surface was convex, and the film could be judged In the state of residual compressive stress, the actual residual stress of the sample measured by an X-ray diffraction stress meter is compressive stress -136MPa. Place one sample membrane face up on the attached figure 2 On the concave mold shown, make the film-based system in a depressed state, fix both ends, and then anneal in an argon atmosphere protection furnace, the annealing temperature is 200°C, the annealing time is 30 minutes, and the film is taken out after cooling with the furnace. In this way, the internal stress of the film can be close to an equilibrium state, and the diffusion of atoms in the film driven by stress release can be reduced. Put another sample directly ...
Embodiment 2
[0021] The 210nm thick Cu-6.8Cr alloy film was prepared on the polyimide substrate (the substrate size is 100mm in length, 100mm in width, and 0.6mm in thickness) by magnetron sputtering method. When taking out the sample, it was found that the entire film surface was convex, and the film could be judged In a state of compressive stress, the actual residual stress of the sample measured by an X-ray diffraction stress meter is compressive stress-181MPa. Place one sample membrane face up on the attached image 3 On the concave mold shown, make the film-based system in a depressed state, fix both ends, and then anneal in an argon atmosphere protection furnace, the annealing temperature is 300°C, and the annealing time is 100 minutes, and the film is taken out after cooling with the furnace. In this way, the internal stress of the film can be close to an equilibrium state, and the diffusion of atoms in the film driven by stress release can be reduced. Put another sample directly ...
Embodiment 3
[0023] A 130nm thick Cu-9.2Cr alloy film was prepared on a polyimide substrate (the substrate size is 100mm in length, 100mm in width, and 0.6mm in thickness) by magnetron sputtering. When the sample was taken out, it was found that the entire film surface was convex, and the film could be judged In the state of residual compressive stress, the actual residual stress of the sample measured by an X-ray diffraction stress meter is tensile stress -225MPa. Place one of the two identical samples face up on the attached Figure 4 On the concave mold shown, make the film-based system in a concave state, fix both ends, and then anneal in an argon atmosphere protection furnace, the annealing temperature is 230°C, and the annealing time is 60 minutes, and the film is taken out after cooling with the furnace. In this way, the internal stress of the film can be close to a balanced state, and the diffusion of atoms in the film driven by the release of residual compressive stress can be red...
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